ABLEBOND 293 Search Results

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Abstract: J-STD-020 S9730 ablebond 293 Nitto
Contextual Info: 05/27/2002 RELIABILITY REPORT FOR DS2153, A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

ablebond 163-4

Abstract: Ablebond 71 GaAs MMIC ESD, Die Attach and Bonding Guidelines HMMC-5023 ABLEBOND 55-1 Ablebond 190
Contextual Info: 23 GHz LNA 21.2 – 26.5 GHz Technical Data HMMC-5023 Features • Frequency Range: 21 .2 – 23.6 GHz and 24.5 – 26.5 GHz Specified 21– 30 GHz Performance • Low Noise Temperature: 226 K (2.5 dB N.F.) Typical • High Gain: 24 dB Typical • 50 Ω Input/Output Matching

Contextual Info: 0032745 13= • APX N AMER PHILIPS/DISCRETE b=)E OM 386M OM387M ^ HYBRID INTEGRATED CIRCUITS FOR INDUCTIVE PROXIMITY DETECTORS Hybrid integrated circuits intended for inductive proxim ity detectors in tubular construction, especially the MS hollow stud. The OM386M is for positive supply voltage and the OM387M is for

ablebond 293-1

Abstract: inductive proximity detector ic NEOSID p9 m8 neosid NEOSID neosid T D
Contextual Info: OM386M OM387M PHILIPS INTERNATIONAL SbE » 7110fl2b G O ^ O ^ Ö3fl H P H I N HYBRID INTEGRATED CIRCUITS FOR INDUCTIVE PROXIMITY DETECTORS Hybrid integrated circuits intended fo r inductive p ro xim ity detectors in tubular construction, especially the M8 hollow stud. The OM386M is fo r positive supply voltage and the OM387M is fo r

inductive proximity detector ic

Abstract: VD neosid ablebond 293-1 NEOSID NEOSID 22 metal detector coil DIAGRAM neosid 10 metal detectors IC neosid CAP OM386M
Contextual Info: • bbS3T31 0032745 13T H A P X N AMER PHILIPS/DISCRETE O M 386M O M 387M b'IE D HYBRID IN TE G R A TE D C IR C U IT S FOR IN D U C TIVE P R O X IM IT Y D E T E C T O R S Hybrid integrated circuits intended fo r inductive p ro xim ity detectors in tubular construction,

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Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 002105 VERSION 1.0 October, 2000 High Accuracy EPROM Programmable Single-PLL Clock Generator L28 Technology, CTI fab 2 and TSMC fab 2A, Taiwan CY2077 390 kHz - 133MHz at 5V 390 kHz -100 MHz at 3.3V CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:

LCMXO2-1200

Abstract: CEL-9750ZHF CEL-9750ZHF10
Contextual Info: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The

Ablebond 71-1

Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
Contextual Info: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or

CV-8710

Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Contextual Info:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010