ABED Search Results

Contextual Info: PBffl GEC plessey DC2000, DC2500 & DC2600 Series MIC PIN DIODES DESCRIPTION APPLICATIONS PIN Diodes for MICs are available in four formats for direct insertion into microstrip circuits. Suitable for use in MICs. LIMITING CONDITIONS 1. Unencapsulated chips in outlines 41,44, abed. 44e

ed27 diode

Contextual Info: Time-Delay and Integration TDI Image Sensor (128 x 1024 element) with Small, High Performance Pixels R.H. Dyck, Y.S. Abedini, J.s. Kim, K.K. Shah Fairchild Weston Systems Incorporated, CCD Imaging Division TIME-DELAY AND INTEGRATION (TDI) This high value is attributed to the good charge transfer efficiency

J394

Contextual Info: Ordering Code:; ; M a te r ia ls : * Insulator: LCP UL 94V — 0, Color Nature * C ontact: P hosphor Bronze 11.95 .470 024 A _A A F CD © © J Series No.: No. of C ircuits Rows loaded with C onta cts: A= abed row ® Plating o ption: * A = Selective Gold fla sh plated over

Contextual Info: 3 .7 Datum 2,65 Anforderunqsstufe Idate class m xxxxxxx X Ü £ E ERNI o ' ini E I RC 2 ON vO n 1 + j, Osi CN o ' +1 abed I i I rm zi ir in nr li 0,65 x 0,3 2,54 .2 ,5 4 3 x 2,5 4 = 7 ,6 2 31 x 2.5 4 = 7 8 ,7 4 95 max. Bestückungsplan / contact layout assemble

Contextual Info: A n fp r d E r u n q s s t u fE abed IHILHIllll'lliTTTTT □ 0,6 2,54 31 x 2,54 - 7 8 , 7 4 95 3 x 2,54 = 7 ,6 2 max. E l ast i sche E i n p r e s s z o n e / compliant pressfit zone housing material .• P B T G F 3 0 I s o l i e r we r k s t o f f / type 7

Contextual Info: [ abed 3 “1 lJ j U II 3 x 2 .5 4 - 7 ,6 2 compliant pressfit zone housing material P B T GF30 Elastische Einpresszo ne / Is o lierw erksto ff / B a u a rt 7 / Bestückungsplan / contact layout • assemble bestückt / type 7 Anford erung sstufe 2 - 4 0 0 S te c k zy k le n /

CviLux

Contextual Info: Materials: * Insulator: LCP UL 9 4 V -0 , Color Nature * C ontact: Phosphor Bronze 11.95 Ordering Code: CRFP M i l l ! D <D ® © (T Series No.: No. of C ircuits Rows loaded with Contacts: A= abed row (?) Plating option: A= Selective Gold flash plated over

Contextual Info: Ordering Code: CRMD 048 I A A F © © @ © M aterials: * In su la to r: LCP UL 9 4 V - 0 , C olor N a ture * C o n ta c t: B rass D Series No.: No. of Circuits Rows loaded with Contacts: A= abed row @ Plating option: A= Selective Gold flash plated over

RD128

Contextual Info: > - 0.2 Anforderunqsstufe /class Stecklänqe ^/mating length ld.-Nr. Stecklänge / mating length oo o ' E SL abed TT 2.54, 3 x 2.54 =7.62 E - early mate, lafe break / voreilend S - standard 90 q32 L - lafe mate, early break / nacheilend yö o o B o 'il 85,2 *°'2

JM CODE

Contextual Info: M aterials: * In sula tor: LCP UL 94V —0, C olor Nature * C ontact: P hosphor Bronze 11.95 .470 Ordering Code; ; CRFD 024 A A A ® © © Series No.: No. o f C ircu its Rows loaded w ith C onta cts: A = abed row @ P lating o ptio n: A= Selective Gold fla sh plated over

Contextual Info: CONNECTOR A55EMBLY EXEM PLARY CONTACT DIMENSIONS LO A D E D DO NOT SCALE DfHFNSiONS IN mm now* ah k if PMUtcruw M E T R I C C O N TA C T LAYOUT RECOMMENDED PCB-HOLE LAY-OUT COMPONENT SIDE SHOWN abed« 1 2?2 2 2 2 2 5 2"2 2~~2~2 2 2 2 2 2 6 - 'S . 4 . ° ,-~t

CviLux

Contextual Info: M a teria ls: * In s u la to r: LCP UL 9 4 V — 0, C o lo r N a ture * C o n ta c t: P h o s p h o r B ronze 11.95 .470 Ordering Code: CRFP D 1 A A | CD © © © © S eries No.: No. o f C irc u its Rows loaded w ith C o n ta c ts : A = abed row © P la tin g o p tio n :

Contextual Info: - Stecklänge 0.2 kL-Nr. Anforderunqsstufe 'm ating length Datum date' class -L / I w lelo -r1 ± r- ][ Stecklänge / mating lengtii 7 \ xxxx INd3 ON cnT abed ][ ] l [ L S E op, o n O CM E - early mate, late break / voreilend M M I M i I M M i n M I i n M I I I I M I

RD128

Contextual Info: Stecklänge / mating lenglti co E SL o ' ao o ' •MA abed E - early mate, late break / voreilend V V S - standard 2.54, L = tate mate, early break / nacheilend 3 x 2.54 =7.62 Bestückungsplan / contact layout Gerader Anschluß 0.6 x 0,6 mm / straight terminal 0.6 x 0.6 mm

APD 4115

Abstract: TT 2146 1030h spns014b SE370C792 saj 100 "TMS370 Family Data Manual" ELLS 110 AN10 TMS370
Contextual Info: TMS370Cx9x 8-BIT MICROCONTROLLER S PN S036A - JANUARY 1996 - R EV ISE D MARCH 1996 FN AND FZ PACKAGES {TO P V IE W & C <D O - < < < !- I li I I II I I II l i I l I l Il Il \ -, 6 5 4 3 2 1 44 43 42 41 40 „ RESET ] 7 39 [ M C INT1 ] 38 [ T1 IC /C R 8 9

MAX5048BAUT

Abstract: MAX5048 SOT23 N-Channel mark 6 MAX5048AAUT-T MAX5048BAUT-T max5048 top
Contextual Info: 19-2419; Rev 2; 5/03 7.6A, 12ns, SOT23 MOSFET Driver The MAX5048A/MAX5048B have internal logic circuitry, which prevents shoot-through during output state changes. The logic inputs are protected against voltage spikes up to +14V, regardless of V+ voltage.

cdt 1120

Abstract: TMS370C722 PT/IR P050h
Contextual Info: TMS370Cx2x 8-BIT MICROCONTROLLER SPNS018C-FEBRUARY 1 9 9 3 -REVISED FEBRUARY 1997 FN AND F Z P A CKAG E S TOP VI EW C M O S / E E P R O M / E P R O M T e c h n o l o g i e s on a Single Device - M a s k - R O M D e v i c e s for H i g h - V o l u m e Produ ction

bauelemente DDR

Abstract: SPF 455 Teltow Mechanische Filter VEB Kombinat zf filter rft katalog SPF 10700 49004 SPF455 490.2159 Kombinat VEB Elektronische Bauelemente
Contextual Info: Passive elektronische Bauelemente O Widerstände Q Kondensatoren 0 Kinlaklfcaüelemenle 2 Suidererzeognisse Passive elektronische Bauelemente Auf allen G ebieten der Elektronik und Elektrotechnik werden an Leistungsfähigkeit, Lebensdauer und Zu­ verlässigkeit elektronischer Bauelemente ständig

Transistor TT 2246

Abstract: TT 2206 datasheet apm 4906 TT 2206 transistor tt 2206 tt 2246 bt 7377 SOT-23 AAAA bc 5478 AAXZ
Contextual Info: SOT TOPMARKS: 2 and 4 Letter ID Coding SOT Topmarks − April 24, 2005 Sorted By Part Number Sorted By Topmark Part Prefix Number Suffix Topmark Package Part Prefix Number Suffix Topmark Package LM 4040A EM3−2.1 FZNG 3/SOT−23 MAX 1916 ZT 1111 6/SOT−23

IRS 640

Abstract: 103 c1k 9240 M9240 al75
Contextual Info: ANALOG DEVICES Low Cost Microprocessor 9ystem Hardware Monitor ADM9240 FEATURES S ix Direct V o lta g e M e a s u re m e n t In p u ts In c lu d in g T w o Processor Core V o lta g e s w ith O n-C hip A tte n u a to rs O n-C hip T e m p e ra tu re S en sor

Contextual Info: ¡iii ICS K_i_^Bp*iBTjj lU fT O I 3 ICS1889 Integrated C ircuit System s, Inc. Advance Information 100Base-FX Integrated PHYceiver TM Features General Description The ICS1889 is a fully integrated physical layer device sup­ porting 100 Megabits per second CSMA/CD Fast Ethernet

Z8S182

Abstract: 75als194 rs232 PICC compiler ZL82 Z80182 ESCC technical manual z182 LocalTalk 8kx8 sram MARK 904A skip 24 evi 10
Contextual Info: 88C0022-001 D O C UMENT CONTROL MAS T E R R e v , B Z80182 EVALUATION BOARD USER MANUAL TABLE OF CONTENTS General Description 1. INSTALLATION 1.1 Memory Configuration 1.2 Emulation Mode Selection 1.3 IBM-PC plug-in card configuration 1.4 Stand-alone system configuration

RELE RAS 1210

Abstract: WD90C24 wd90c33 A27Z PARADISE vlsi 386sx 80386DX 16 BIT wd90c31 80386SX 208-pin microchannel
Contextual Info: 5ME T71Ö52S » aaiboa? WD90C33 High Performance VGA Controller Chip for PClATIISAIEISAfVESA and PS/2 Systems Advanced Information gS WESTERN DIGITAL \ A 235 • IIIDC WESTERN DIGITAL CORP SHE D ■ T71fl22fl □□lbQ2fl 17T ■■ UI1>C T-52-33-45 Copyright 1992 Western Digital Corporation

OMAP5430

Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Contextual Info: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.