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    A60020 Search Results

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    A60020 Price and Stock

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    Navitas Semiconductor MURTA60020R

    - Bulk (Alt: MURTA60020R)
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    Avnet Americas MURTA60020R Bulk 10 Weeks 24
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    • 100 $217.38
    • 1000 $203.82
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    Navitas Semiconductor MURTA60020

    - Bulk (Alt: MURTA60020)
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    Avnet Americas MURTA60020 Bulk 10 Weeks 24
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    • 100 $217.38
    • 1000 $203.82
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    Ohmite Mfg Co FPA600 20K J

    Planar Resistors - Chassis Mount 20K OHM 5% 600W
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    Mouser Electronics FPA600 20K J
    • 1 $171.39
    • 10 $120.91
    • 100 $120.91
    • 1000 $120.91
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    TTI FPA600 20K J Box 25
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    • 100 $106.40
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    Richardson RFPD FPA600 20K J 25
    • 1 $101.39
    • 10 $101.39
    • 100 $90.75
    • 1000 $90.75
    • 10000 $80.14
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    Ohmite Mfg Co FPA600 20R K

    Planar Resistors - Chassis Mount 600 Watts Thick Film Power 20 Ohms 10%
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    Mouser Electronics FPA600 20R K
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    • 100 $114.40
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    RS FPA600 20R K Bulk 32 Weeks 25
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    • 100 $160.93
    • 1000 $160.93
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    Richardson RFPD FPA600 20R K 25
    • 1 $94.47
    • 10 $94.47
    • 100 $83.89
    • 1000 $83.89
    • 10000 $73.25
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    Ohmite Mfg Co FPA600 200R J

    Planar Resistors - Chassis Mount 600 Watts Thick Film Power 200 Ohms 5%
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    Mouser Electronics FPA600 200R J
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    • 100 $119.31
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    RS FPA600 200R J Bulk 32 Weeks 25
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    • 100 $167.84
    • 1000 $167.84
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    Richardson RFPD FPA600 200R J 25
    • 1 $98.52
    • 10 $98.52
    • 100 $87.85
    • 1000 $87.85
    • 10000 $77.25
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    A60020 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Contextual Info: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    PDF