A6 ROC Search Results

Contextual Info: 8/21/12 HEX40-AB-00-17-A6-2-DS Product Details - TE T E C onnec tivity My C art | My Part Lists | Sign In/Register English C hange What can we help you find? Products Industries Resources About TE Support Center HEX40-AB-00-17-A6-2-DS Product Details Share

A3972SB

Abstract: 7407 A3972SB 1 A3972 1522-K HEADER13X2 DUAL18CON strb 76-0852-000-SCH 2313B
Contextual Info: 5 4 J1 A B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A1 OUT1A A2 OUT1B A3 OUT2A A4 OUT2B A5 VBB A6 A7 VDD A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 OUT1A OUT1B OUT2A OUT2B J3

A3971SLB

Abstract: HEADER13X2 DUAL18CON PWM23
Contextual Info: A B 1 VDD B1 B2 B3 B4 VBB B5 B6 VDD B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A1 OUT1A A2 OUT1B A3 OUT2A A4 OUT2B A5 VBB A6 A7 VDD

200B

Abstract: 27C512-12 27C512-15 27C512A RG41 DS11173F
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM DESCRIPTION 30 31 1 32 2 29 6 28 7 27 27C512A 5 8 9 10 11 12 26 25 24 23 22 13 A8 A9 A11 NC OE/VPP A10 CE O7 O6 20 19 18 17 16 21 15 A6 A5 A4 A3 A2 A1 A0 NC O0 3 4 A7 A12 A15 NU Vcc A14 A13 PLCC 14 DIP/SOIC A15 A12 A7 A6 A5

Microchip 27C512

Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM DESCRIPTION 30 31 1 32 2 29 6 28 7 27 27C512A 5 8 9 10 11 12 26 25 24 23 22 13 A8 A9 A11 NC OE/VPP A10 CE O7 O6 20 19 18 17 16 21 15 A6 A5 A4 A3 A2 A1 A0 NC O0 3 4 A7 A12 A15 NU Vcc A14 A13 PLCC 14 DIP/SOIC A15 A12 A7 A6 A5

27C512 microchip

Abstract: 27C512 microchip 45 27C512* PLCC Microchip 27C512 200B 27C512-12 27C512-15 27C512A 27C512-15 MICROCHIP
Contextual Info: 27C512A 512K 64K x 8 CMOS EPROM DESCRIPTION 30 31 1 32 2 29 6 28 7 27 27C512A 5 8 9 10 11 12 26 25 24 23 22 13 A8 A9 A11 NC OE/VPP A10 CE O7 O6 20 19 18 17 16 21 15 A6 A5 A4 A3 A2 A1 A0 NC O0 3 4 A7 A12 A15 NU Vcc A14 A13 PLCC 14 DIP/SOIC A15 A12 A7 A6 A5

200B

Abstract: 27LV256 8X13
Contextual Info: 27LV256 256K 32K x 8 Low-Voltage CMOS EPROM PACKAGE TYPES PDIP VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS 30 1 31 32 2 3 4 29 6 28 7 27 8 9 10 11 26 25 24 23 A8 A9 A11 NC OE A10 CE O7 O6 20 19 18 17 16 21 15 22 13 14 12 SOIC VPP A12 A7 A6 A5 A4 A3 A2 A1

27C256 Microchip

Abstract: Microchip 27C256 200B 27C256 27C256-10 27C256-12 27C256-15 27C256-20
Contextual Info: 27C256 256K 32K x 8 CMOS EPROM 30 31 1 32 2 A7 A12 VPP NU Vcc A14 A13 3 4 5 29 6 28 7 27 8 9 10 11 26 25 24 23 A8 A9 A11 NC OE A10 CE O7 O6 20 19 18 17 21 16 22 13 15 12 14 A6 A5 A4 A3 A2 A1 A0 NC O0 DIP/SOIC VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS

27C256 Microchip

Abstract: fd179x 200B 27C256 27C256-10 27C256-12 27C256-15 27C256-20 MICROCHIP 27C256
Contextual Info: 27C256 256K 32K x 8 CMOS EPROM 30 31 1 32 2 A7 A12 VPP NU Vcc A14 A13 3 4 5 29 6 28 7 27 8 9 10 11 26 25 24 23 A8 A9 A11 NC OE A10 CE O7 O6 20 19 18 17 21 16 22 13 15 12 14 A6 A5 A4 A3 A2 A1 A0 NC O0 DIP/SOIC VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS

DIODE A6 sod110

Abstract: bas216
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET A6 andbook, halfpage M3D179 BAS216 High-speed switching diode Product specification Supersedes data of April 1995 1996 Apr 03 Philips Semiconductors Product specification High-speed switching diode BAS216 FEATURES APPLICATIONS

DIODE A6 sod110

Abstract: BAS216 Diode smd code 805 SMD MARKING 541 DIODE top mark smd Philips diode SMD MARKING CODE A6 A6 SOD110
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET A6 handbook, halfpage M3D179 BAS216 High-speed switching diode Product specification Supersedes data of April 1995 File under Discrete Semiconductors, SC01 1996 Apr 03 Philips Semiconductors Product specification High-speed switching diode

HD6309

Abstract: hitachi HD6309 HD63B09 HD63C09 PCR 606 J HD6809 adcb 27 byg 220 HD6800 HMCS6800
Contextual Info: HD63B09, HD63C09-CMOS MPU Micro Processing Unit Pin Arrangement Description The HD6309 is the highest 8-bit microprocessor of HMCS6800 family, which is compatible with the conventional HD6809. v ss NMI IRQ FiRQ BS BA Vcc Ao A, a2 A3 Ä4 As A6 Ä7

powerflex 753 programming manual

Abstract: 20-HIM-A6 20-HIM-C6S AC DRIVE POWERFLEX 755 20-HIM-B1 20-HIM-A3 rockwell powerflex 70 20-750-DNET 20HIM-IN002 powerflex 755
Contextual Info: User Manual PowerFlex 20-HIM-A6 / -C6S HIM Human Interface Module FRN 1.xxx Important User Information Solid-state equipment has operational characteristics differing from those of electromechanical equipment. Safety Guidelines for the Application, Installation and Maintenance of Solid State Controls (publication SGI-1.1 available from

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A6 7460 JM NOTES: 1 - PLUG KIT CONSISTS OF : PRE-INSERTED PLUG HOUSING 2 - MATERIALS : FRONT HOUSING PLASTIC : CONTACTS : CLEAR POLYCARBONATE, UL 9 4-V O PHOSPHOR BRONZE, SELECTIVE GOLD PLATING 3 - CONTACTS TERMINATE STRANDED & SOLID CONDUCTORS UP

ISPLSI 2032A-180LTN44

Abstract: 2032A 44-PIN 2032A-135LT441 2032A-80Ltn
Contextual Info: LeadFree Package Options Available! ispLSI 2032/A In-System Programmable High Density PLD Features Functional Block Diagram • ENHANCEMENTS S Logic Array A6 D Q D Q A5 D Q EW Input Bus GLB A4 0139Bisp/2000 FO R N fmax = 180 MHz Maximum Operating Frequency

15X15

Contextual Info: - 1.100 DATE REV ECN 1/25/06 A6 7453 JM 4/11/06 A7 7579 TRM APP’D. BY - [27.94] .125 ±.010 [3.18 ±0.25] B B GROUND POST 2 PLASTIC SNAP LOCATOR (2) .210 .012X.025 [0.30x0.64] .170 PH-BR CONTACTS: GOLD PLATED OVERALL .110 .210 .170 .130 .070 .090 .030

200B

Abstract: 27LV256 8X13
Contextual Info: 27LV256 256K 32K x 8 Low-Voltage CMOS EPROM PDIP VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP or SOIC packaging is available.

Contextual Info: DATE REV 1/30/06 ECN APP’D. BY 3/24/08 A5 7455 JM A6 8388 JM B B NOTES: - .100 [2.54] 4 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: 2 REV ECN APP'D. BY 1/24/06 DATE A6 7448 JM 3/24/08 A7 8388 JM 2/06/09 A8 8652 TA B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY — SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

a006

Abstract: SS7-180
Contextual Info: DATE REV ECN APP'D. BY 1-19-06 A6 7451 JM 3-21-06 A7 7549 SAW 12-29-06 A8 7882 TRM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

SS-610808-NF-P-5

Abstract: CT61
Contextual Info: -.7 7 0 — [19.56] DATE REV ECN APP’D. BY 1/25/06 A6 7453 JM — .805— [20.45] •POSITION #1 B B -D NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV 1/25/06 ECN A5 7452 JM 3 -2 1 -0 6 A6 7549 TRM APP'D. BY B B 4.612 [117.14] BOTTOM SURFACE OF JACK (PCB SURFACE) • -4.554 [115.67] MAX.- ( .148 [3.75] ) TO HIGHEST POINT OF BEAM NOTES: ( .014 [0.36] H -4.300 [109.22] ( .083 [2.12] ) — TO HIGHEST

Contextual Info: DATE REV 1/25/06 ECN A5 7453 JM 4/11/06 A6 7579 TRM APP'D. BY .125 [3.18] .090 [2.29] .430 [10.92] B B .125 ±.010 [3.18 ±0.25] GROUND POST PLASTIC SNAP LOCATOR 2 .012x.025 [0.30x0.64] P H -B R CONTACTS: GOLD PLATED OVERALL NOTES: 1. CONNECTOR MATERIALS:

Contextual Info: — .050 [1.27] TYP TOL. NON-ACCUM .050 [1.27] — DATE REV ECN 4 -6 -0 6 A5 7572 TRM 7-17-06 A6 7577 TRM APP'D. BY LED SPECIFICATIONS COLOR WAVELENGTH * FORWARD VOLTAGE MAX * FORWARD VOLTAGE (TYP) YELLOW DIFFUSED 590 nm 2.5 V 2.1 V LED TYPE SINGLE COLOR LED