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54122-412202500LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
PDF
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10137785-041221LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 4 Positions, Non GW Compatible, with Post, Tray packing. |
PDF
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10137784-04122LF
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Amphenol Communications Solutions
|
Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, Tin plating, Black Color, 4 Positions, Non GW Compatible, Tray packing. |
PDF
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68604-122HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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54122-109501450LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch |
PDF
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