TQFP80 Search Results

Contextual Info: STE08PSP 08-channel high-power integrated PSE line manager Preliminary Data Features • Full programmable power sourcing equipment PSE power control device ■ Supports up to 8 independent high-power (up to 50 W) channels, no need for external FET ■ Low cost small size TQFP80 14 x14 exposed

MS-026

Abstract: TQFP80
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B

Contextual Info: ST7MDT20-T80/DVP TQFP80 14x14 connection kit for ST7MDT20-DVP3 Data brief Features Figure 2. • TQFP80/64/44 adapter (DB530): Allows the connection of your ST7MDT20-DVP3 emulator to your application board in place of your ST7. ■ TQFP80 (14x14) device adapter (DB531):

Contextual Info: TQFP80-P-1212-0.50-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 0.40 TYP. 4 版/96.10.28

TQFP80V

Contextual Info: TQFP80V LSI Assembly • TQFP80V 14.0 ± 0.3 12.0 ± 0.2 41 61 40 80 21 1.2Max. 1.0 ± 0.1 0.1 ± 0.1 1 0.2 ± 0.1 0.5 12.0 ± 0.2 14.0 ± 0.3 60 20 0.5 The contents described herein are subject to change without notice. 0.125 ± 0.1 0.08 Units : mm Appendix

TQFP80 package

Abstract: MS-026 TQFP80
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 w M θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A w M D B HD v M B

Contextual Info: TQFP80-P-1212-0.50-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.40 TYP. 4/Oct. 28, 1996

Contextual Info: QFP-Socket and Emulation-Adapter HHSÌ3 QFP/TQFP80 20 x 20 0.65 mm pitch IC - Dimensions Adapter PCB-Layout (View from Soldering Side) Socket PCB-Layout (Top View) 2-20. 50min .4-14. 70max .65 x 19.= ß. 6 5 * 1 9 = 1 2 . 3 5 ± 0 . 12.35 ±0. 4 - 1 3. 0 Ori I r

TQFP80-P-1212-0

Contextual Info: TQFP80-P-1212-0.50B Uniti rin 14, 0±0, 2 12, 0 ± 0 , 1 >ln O J 41 60 CL 61 40 CU 80 21 Ur CD +1 O CD +1 O CÙ ' 1 ^ t~ 20 1, 25TYP 0, 5 Pi q +0, 05 u. c -o . 04 eia i<k> o o+1 c cu o cu LO X O LO P IO . 081 +1 CD Apr ,2000

Contextual Info: 80P6C-A Plastic 80pin 12✕12mm body TQFP EIAJ Package Code TQFP80-P-1212-0.50 Weight g Lead Material Alloy 42 MD e JEDEC Code – HD D ME 61 b2 80 60 1 I2 20 HE E Recommended Mount Pad Symbol 41 21 40 A L1 F A1 c A2 e b L y Detail F A A1 A2 b c D E e HD

GDM1602A

Abstract: GDM1602 16x2 lcd xiamen BERG 14 pin connector KobiConn lcd gdm1602a 2 pin connector sip2 Xiamen Ocular LCD 16X2 ALPHANUMERIC ST7FLITE39
Contextual Info: STEVAL-CCH002V1 Bill of material Bill of material Designator Qty Reference Value/ generic part number Package Manufacturer U11 1 HDMI/DVI 2:1 switch STHDMI002A TQFP48 STMicroelectronics U35 1 HDMI/DVI 3:1 switch and equalizer STDVE003A TQFP80 STMicroelectronics

TQFP80V

Contextual Info: TQFP80V LSI Assembly Units : mm • TQFP80V 14.0±0.3 12.0±0.2 41 61 40 80 21 1.2Max. 1.0±0.1 0.1±0.1 1 0.5 12.0±0.2 14.0±0.3 60 20 0.125±0.1 0.2±0.1 0.5 ∗ The contents described herein are subject to change without notice. 0.08

TQFP80U

Contextual Info: TQFP80U LSI Assembly Units : mm • TQFP80U 12.0±0.3 10.0±0.2 41 61 40 80 21 1.2Max. 1.0±0.1 0.1±0.1 1 20 0.4 0.5 10.0±0.2 12.0±0.3 60 0.125±0.1 0.08 0.15±0.1 ∗ The contents described herein are subject to change without notice.

sot375

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP80: plastic thin quad flat package; 80 leads; body 12 x 12 x 1.0 mm SOT375-1 c y X A 60 41 61 40 ZE e E HE A 3 A A2 A1 wM θ bp Lp pin 1 index L 80 21 detail X 20 1 ZD e bp v M A wM D B HD v M B

XFORMER

Abstract: exact difference between smps dc-dc converter E-STE08PSP p33 thermal senser BAT49 IEE802 RFC3621 TQFP80 mps 1580 RESISTOR 820 OHM
Contextual Info: STE08PSP 08-channel high-power integrated PSE line manager Preliminary Data Features • Full programmable power sourcing equipment PSE power control device ■ Supports up to 8 independent high-power (up to 50 W) channels, no need for external FET ■ Low cost small size TQFP80 14 x14 exposed

analog audio delay

Abstract: TQFP100 tQFP100 package TQFP80 package dolby STV82x8 TQFP80 5 band equalizer TQFP-100
Contextual Info: STV82x8 Digital Audio Decoder/Processor for BTSC Television/Video Recorders DATA BRIEF Features • ■ ■ ■ Fully Automatic Multi-Standard Demodulation – M/N standards – FM mono – BTSC US MTS stereo and SAP standards 2 V8 T S x8 TQFP80 Package

TQFP80 package

Contextual Info: TQFP80-P-1212-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

RFC3621

Abstract: TQFP80 "power sourcing equipment"
Contextual Info: STE08PSP 08-channel high-power integrated PSE line manager Data Brief Features • Full programmable Power Sourcing Equipment PSE power control device ■ Supports up to 8 independent high-power (up to 50 W) channels, no need for external FET ■ Low-cost small size TQFP80 14 mm x 14 mm

SSD1502G32

Abstract: SSD1502 cyberdisplay VGA kopin KCD-A900-QA-TP KCD-A900-QA cyberdisplay kopin vga SSD1502QT4 color space look-up table mapping
Contextual Info: SSD1502 Display Driver for The CyberDisplay VGA Color Display Part Numbers: KCD-A900-QA TQFP80 package KCD-A900-QA-TP (BGA80 package) Ver. 0.1 August 14, 2006 KOPIN TABLE OF CONTENTS 1 GENERAL DESCRIPTION. 5

12X12

Contextual Info: SANYO Semiconductor Thin Quad Flat Package 80Pin Plastic TQFP80J 12X12 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: Package outline TQFP80: plastic thin quad flat package; 80 leads; 14 x 14 x 1.1 mm SOT1093-1 c y X 60 A 41 40 61 ZE e E HE A A2 A3 A1 w θ bp detail X pin 1 index L 21 80 1 20 bp D e w ZD A v B 2.5 5 mm scale Dimensions Unit max nom min v B HD mm Lp A 1.2

PTQP0080KC-A

Abstract: P-TQFP80-12x12-0 P-TQFP-80
Contextual Info: JEITA Package Code P-TQFP80-12x12-0.50 RENESAS Code PTQP0080KC-A Previous Code TFP-80C/TFP-80CV MASS[Typ.] 0.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 60 41 61 40 bp c c1 HE Reference

Contextual Info: TQFP80V LSI Assembly Units : mm • TQFP80V 14.0 12.0 60 41 40 80 21 14.0 12.0 61 1 20 H=1.2Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any

DB531

Abstract: TQFP80 14x14 tqfp 64 socket
Contextual Info: ST7MDT20-T80/DVP TQFP80 14x14 Connection Kit for ST7MDT20-DVP3 DATA BRIEF The TQFP80 (14x14) Connection Kit (ST7 MDT20-T80/DVP) provides the hardware you need to connect your ST7MDT20-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in the TQFP80 (14x14)