TMLF22D Search Results

JESD78

Contextual Info: RELIABILITY REPORT 07/05/2007 CONTACT: PRODUCT DESCRITION: Micrel QA/REL MIC2225-4MYMT 408 435-3476 2MHz 600 ‘mA Buck with LDO in 10L TMLF22D RELIABILITY RATINGS ESD-MM Machine Model R= Zero Ohms C= 200 pf ESD-HBM Human Body Model MIL-STD 883 Method 3015

Contextual Info: SPECIFICATION NO. REV. 2300-0011 A DOCUMENT TITLE: THERMAL CHARACTERISTICS OF MICREL IC ASSEMBLY OWNER: PACKAGE ENGINEER REQUIRED APPROVALS: PACKAGE ENGINEER DIRECTOR OF PACKAGING AND SUBCONTRACT ENGINEERING RELIABILITY MANAGER QUALITY VP AFFECTED PARTY NOTIFICATION: DO NOT INCLUDE REGULAR DISTRIBUTION

Contextual Info: CMOS CSI 0.5 micron Process OPERATING LIFE @ TA = +125C AT RATED VOLTAGE 7/14/2010 Device MIC2003 1.2YM5 MIC2004 0.8YM5 MIC2005A 1YM6 MIC2005A 2YM6 MIC2005A 1YM6 MIC2005A 2YM6 MIC2005M 0.8YM5 MIC2005M 0.5YM6 MIC2005 0.5BM6 MIC2006 1.2BM6 MIC2007 YM6 MIC2007 YM6

KSZ8041

Abstract: LM2576 MTBF vcsel spice model MIC4129 mic44r22 ksz8692 MICREL MIC marking DFB laser diode spice model KSZ9021RLI KSZ8041TLI
Contextual Info: Military Catalog May 2009 Dear Valued Customer, Micrel is an enduring DSCC certified company that has, for many years, provided Mil-Std-883B products in hermetic ceramic packages. We have also provided products governed by source controlled drawings SCD where baseline control is important. Our in-house, U.S.-based wafer

TDFN22

Contextual Info: BCD_0.35 micron BiPolar Process OPERATING LIFE @ TA = +125C AT RATED VOLTAGE Sample Size Act Hrs Fails Act Hrs Total Fails Dev. Hrs DEVICE V_op LOT# Package MIC23164 YMT MIC23164 YMT MIC23164 YMT +5.5V +5.5V +5.5V ZAA43074MNM BA35823MNAR BA36844MNC TDFN22-10

LD33 VOLTAGE REGULATOR

Abstract: LD33 regulator LD33 VOLTAGE REGULATOR 3.3v LD33 SOT 223 LD33 LD33 SOT223 Analog Marking Information LD50 VOLTAGE REGULATOR LD33 marking SOT223 marking ld33
Contextual Info: Packaging for Automatic Handling — Tape & Reel General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO‑92 device leads are secured