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    TC1072/1073 Search Results

    TC1072/1073 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-107341050LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch. PDF
    51731-073LF
    Amphenol Communications Solutions PwrBlade®, Power Connectors, 24S 6P Right Angle Header, Solder To Board PDF
    98401-107-32LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch. PDF
    54121-107361150LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. PDF
    54242-107321300LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 32 Positions, 2.54mm (0.100in) Pitch. PDF

    TC1072/1073 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    TC1072-1073
    Microchip Technology 50mA and 100mA CMOS LDOs with Shutdown, ERROR Output, and VREF Bypass Original PDF 198.76KB 15