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    SIGC08T60S Search Results

    SIGC08T60S Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SIGC08T60S
    		Infineon Technologies IGBT Chips; Package: --; Technology: Fast IGBT 3; VDS (max): 600.0 V; IC (max): 15.0 A; VCE(sat) (max): 2.05 V; VGE(th) (min): 4.1 V; Original PDF 73.95KB 4
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    SIGC08T60S Price and Stock

    Infineon Technologies AG

    Infineon Technologies AG SIGC08T60SEX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60SEX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC08T60SEX1SA1 Waffle Pack 31,041
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    Infineon Technologies AG SIGC08T60SYX1SA2

    - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60SYX1SA2)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC08T60SYX1SA2 Waffle Pack 453
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    Infineon Technologies AG SIGC08T60SX1SA2

    - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60SX1SA2)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC08T60SX1SA2 Waffle Pack 453
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    SIGC08T60S Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: SIGC08T60S 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC08T60S VCE ICn 600V 15A This chip is used for:


    Original     		SIGC08T60S Q67050A4395-A101 L7531D, PDF