SC662 Search Results

BL-5B

Contextual Info: SC662 Backlight Driver for 6 LEDs with SemPulse Interface POWER MANAGEMENT Features                 Description Input supply voltage range — 2.9V to 5.5V Very high efficiency charge pump driver system with

Contextual Info: SC662 C lock G enerator fo r Power PC Designs with SDRAM and USB S upport Prelim inary Product Information FREQUENCY TABLE _ PRODUCT FEA TURES_ Sel2 S ell SelO CPU PCI • Supports Pentium and Cyrix CPU’s. tristate tristate ■ 16 host clocks for additional SDRAM support.

SC662

Abstract: Backlight Driver for 6 LEDs with SemPulse® Interface SC662ULTRT JESD22-A114
Contextual Info: SC662 Backlight Driver for 6 LEDs with SemPulse Interface POWER MANAGEMENT Features                 Description Input supply voltage range — 2.9V to 5.5V Very high efficiency charge pump driver system with

IMISC662AAB

Abstract: SC662 sdram voltage
Contextual Info: SC662 Clock Generator for Power PC Designs with SDRAM and USB Support Preliminary Product Information FREQUENCY TABLE PRODUCT FEATURES Sel2 Sel1 Sel0 CPU PCI n Supports Pentium and Cyrix CPU’s. tristate tristate n 16 host clocks for additional SDRAM support.

Contextual Info: Mounting Pad Packing NEC Tray Name LA-1007B-1 LA-296A 24 pin TSOP I (6 x 16) 1 24 detail of lead end R Q S 12 13 N K H D M M L B C I G A J P NOTES ITEM (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Buck Boost LDO LED Driver Charge Pump Load Switch POWER Greener, Smarter, Smaller Power Management Power Management Solutions Buck • High Efficiency • Fast Response • Smallest Footprint Boost • High Efficiency • Small Footprint LDO • Ultra-Low Dropout

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

Contextual Info: Mounting Pad Packing NEC Tray Name LA-1007B-1 LA-296A 24 pin TSOP I (6 x 16) 1 detail of lead end 24 S 12 Q 13 R P I A J C H L N G D M B M K NOTES ITEM (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.

automotive eDP interface

Contextual Info: Buck Boost LDO LED Driver Charge Pump Load Switch POWER Greener, Smarter, Smaller Power Management Power Management Solutions Buck • High Efficiency • Fast Response • Smallest Footprint Boost • High Efficiency • Small Footprint LDO • Ultra-Low Dropout

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages