SC5022 Search Results

Contextual Info: SC5022F SMD POWER INDUCTORS XXX MARKING ● Features 1. Open frame construction 2 Excellent Power Density 3 Engineered to Provide High Efficiency ELECTRICAL CHARACTERISTICS DC Resistance Ω MAX (2) (1) BC5022F I nduct ance decr ease bybycur r ent SC5022F

Contextual Info: SC5022FH SMD POWER INDUCTORS XXX MARKING ● Features 1. Open frame construction 2 Excellent Power Density 3 Engineered to Provide High Efficiency ELECTRICAL CHARACTERISTICS Test Frequency DCResistance Ω MAX (2) (1) Saturation (3) Current (A) Temperature

C5039

Contextual Info: SC5022 THRU SC5039 DACO SEMICONDUCTOR CO., LTD. TRANSIENT VOLTAGE SUPPRESSOR TYPE 50A Features 50Amp SOZA CELL High Surge Capability High Current Capability Low leakage B Maximum Ratings Operating Temperature: -65 C to +175 Storage Temperature: -65 C to +175

Contextual Info: SC5022F SMD POWER INDUCTORS XXX MARKING Features 1. Open frame construction 2 Excellent Power Density 3 Engineered to Provide High Efficiency ELECTRICAL CHARACTERISTICS Inductance Test uH Frequency DC Resistance ( MAX) (2) (1) Saturation(3) Temperature (4)

Contextual Info: SC5022C SMD POWER INDUCTORS XXX MARKING Features 1. Magnetically shielded construction 2 Excellent Power Density 3 Engineered to Provide High Efficiency ELECTRICAL CHARACTERISTICS DC Resistance MAX (2) (1) Saturation(3) Temperature (4) Current Current (A)

Contextual Info: SC5022C SMD POWER INDUCTORS XXX MARKING ● Features 1. Magnetically shielded construction 2 Excellent Power Density 3 Engineered to Provide High Efficiency ELECTRICAL CHARACTERISTICS DC Resistance Ω MAX (2) (1) BC5022C I nduct ance decr ease by r ent SC5022C

Contextual Info: SC5022FH SMD POWER INDUCTORS XXX MARKING Features 1. Open frame construction 2 Excellent Power Density 3 Engineered to Provide High Efficiency ELECTRICAL CHARACTERISTICS Inductance uH Test Frequency DCResistance ( MAX) (2) (1) Saturation (3) Current (A)

SC5022

Abstract: SC5039
Contextual Info: BL GALAXY ELECTRICAL SC5022 - - - SC5039 TRANSIENT VOLTAGE SUPPRESSOR VOLTAGE RANGE: 20 - 41 V CURRENT: 50 A FEATURES SOZA CELL High surge capability High current capability 6.58 Low leakage 1.1 2.1 6.55 7.23 7.5 mm MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

SC5026-1R0

Abstract: SC5026 SC5026-1R0MU SC5018-1R2M SC5018-1R8M 21A18 SC5018 sc5018-2r7mu SC5021-R80MU SC5015-1R2M
Contextual Info: SC50xx Series SMD High Current Inductor RoHS COMPLI ANT Features: z 0.50” package SMD inductor up to 80 Amp Imax z Ideally for DC to DC converter. VRM & high density board design z Low leakage flux, shielded inductor design z Low profile z Operating temperature: -400 to 1500 C

K778

Contextual Info: Package Information Package Informatoli Plastic DIP Unit: mm Inch BPin ^.6(0.378)^ 10.6niax(0.417max) ¡8 5 n n ri n 2 5 o r-‘ o' LJ U ; ! o .a s ji. U O 4 1.3 (0.035) (0.051) 1 7 JÎ2 (0.300)1 T 2 .5 4 î0 .2 5 _ ^ j J[ 0 . 4 8 î 0 . 1 (O .lO O iO .O lO )

DIP22 Package

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

0080L

Abstract: 2.5 3.5 adapter hdd PWS-201-1H
Contextual Info: Contact Us Advanced Search Search Reseller Resource Center SuperChassis 502-200B Products Chassis 1U [ SC502-200B ] Key Features 1. 200W High-Efficiency Low Noise Power Supply Available Colors 2. 1x 3.5" Internal Drive Bay Black 3. OR 2x 2.5" Internal Drive Bay Optional

Contextual Info: Package outline DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME seating plane D A2 L A A1 c e Z w M b1 (e 1) b 22 MH 12 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max.

MD400-1A

Abstract: LA-0530B-1
Contextual Info: Packing Name Magazine MD400-1A NEC Tray LA-0530B-1 22 pin DIP 400 mil 22 12 1 11 A K I P L J H C F G D N M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

P 037

Abstract: LA-0530B-1
Contextual Info: Packing NEC Tray Name LA-0530B-1 22 pin DIP 400 mil 22 12 1 11 A K I L P J H F C G D N M B NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel.