QFP52 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP52 package SOT379-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

sot379

Contextual Info: PDF: 1999 Nov 03 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM bp

Contextual Info: Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM bp pin 1 index L 14 52 detail X 13 1 e bp v M A ZD wM θ Lp D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM bp pin 1 index L 14 52 detail X 13 1 e bp v M A ZD wM θ Lp D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

qfp52

Abstract: QFP52-S1
Contextual Info: PACKAGE DIMENSIONS QFP52-S1 12.0 ±0.4 0 ~10ﾟ 10.0 ±0.3 26 52 14 10.0 ± 0.3 40 12.0 ± 0.4 27 39 13 0.32 ± 0.06 +0.07 0.13-0.04 1.00 ± 0.05 0.65 0.15 M 1.20MAX 1 0.6 ±0.2 0.10 0.1 ± 0.05 Mold Base UNIT : mm GD-Q05201G-1 Ver.2005-11-24

QFP-52

Abstract: QFP52 MS-022
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 e bp v M A ZD wM

PLL 2400 MHZ

Contextual Info: FMM4024KW 1.0625Gbps FIBRE CHANNEL REPEATER 1C FEATURES • 1.0625Gbps Repeater IC for FIBRE CHANNEL Hubs/Disk Arrays • Low Power Consumption: 0.5W • Single Power Supply Voltage: +3.3V • LVTTL and PECL Interface • Thermally Enhanced, QFP52 Mold Package with Heat Sink

Contextual Info: QFP52-P-1010-0.65

QFP52-A2

Abstract: QFP52
Contextual Info: パッケージ外形図 QFP52-A2 13 .2 ±0. 2 0 ～10 ° 10.0 ±0. 2 27 26 52 14 10.0 ± 0. 2 40 1 1 3.2 ± 0.2 39 0. 3 ±0 .1 1.1 TYP 0.13 0. 8 ± 0 .2 13 M 2. 0 ± 0 .2 +0. 1 0 .15 -0. 05 2. 45MA X 0. 65 0.1 11 .6 ±0. 2 + 0.15 0 .1 - 0.10 Mol d Ba se GD-Q05201T-0

QFP52-S1

Contextual Info: パッケージ外形図 QFP52-S1 12.0 ±0.4 0 ~10ﾟ 10.0 ±0.3 52 14 1 +0.07 0.13 -0.04 1.00 ± 0.05 0.65 13 0.32 ± 0.06 0.1 ± 0.05 0.10 Ver.2005-11-24 M ﾓ-ﾙﾄﾞ 底 面 0.6 ±0.2 GD-Q05201G-1 0.15 1.20MAX 26 10.0 ± 0.3 40 12.0 ± 0.4 27 39 単位 : mm

JRC 2355

Abstract: FMM4024KW QFP52 PLL 2400 MHZ
Contextual Info: FMM4024KW 1.0625Gbps FIBRE CHANNEL REPEATER IC FEATURES • 1.0625Gbps Repeater IC for FIBRE CHANNEL Hubs/Disk Arrays • Low Power Consumption: 0.5W • Single Power Supply Voltage: +3.3V • LVTTL and PECL Interface • Thermally Enhanced, QFP52 Mold Package with Heat Sink

Contextual Info: QFP52—P—1010—0.65 Unii;: nn o i +i i_n ci OJ LO 0 n. ft±n. ? OJ LO O o o o Feb.2007

Contextual Info: QFP52—P—1010—0.65 Unii;: nn Feb,2007

QFP52

Abstract: MS-022 sot379
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2.0 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM

QFP52-A2

Abstract: QFP52
Contextual Info: PACKAGE DIMENSIONS QFP52-A2 13 .2 ±0. 2 0 ～10 ° 10.0 ±0. 2 27 26 52 14 10.0 ± 0. 2 40 1 1 3.2 ± 0.2 39 0. 3 ±0 .1 1.1 TYP 0.13 0. 8 ± 0 .2 13 M 2. 0 ± 0 .2 +0. 1 0 .15 -0. 05 2. 45MA X 0. 65 0.1 11 .6 ±0. 2 + 0.15 0 .1 - 0.10 Mol d Ba se GD-Q05201T-0

MS-022

Abstract: QFP52
Contextual Info: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-2 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM bp

QFP52

Contextual Info: PDF: 1999 Nov 03 Philips Semiconductors Package outline QFP52: plastic quad flat package; 52 leads lead length 1.6 mm ; body 10 x 10 x 2 mm SOT379-1 c y X A 27 39 40 ZE 26 e E HE A A2 (A 3) A1 wM θ bp Lp pin 1 index L 14 52 detail X 13 1 v M A ZD e wM bp

SFE10.52MJA10

Abstract: 8745H
Contextual Info: Philips Semiconductors Preliminary specification Satellite sound receiver with l2C-bus control TDA8745 FEATURES • On-chip frequency synthesizer and mixer: - tuning range 4 to 9.77 M Hz - reference oscillator 4 M H z using a crystal or 4 MHz frequency source

TA1294F

Abstract: TD62C950RF TD62C950 TD62C950RFg TB9250N TB9248N PA2028A ta1219n TA8310 TA8690ANG
Contextual Info: TOSHIBA TOSHIBA CORPORATION SEMICONDUCTOR COMPANY PAGE : 1 of 3 REF NO. : KT404-006 DATE : April 7, 2004 Please write customer’s name to submit. Shift to Lead Pb -Free Packages for System LSI Products (2nd Stage) In consideration of the global environmental issues, Toshiba has been making efforts

TK10420

Abstract: TK10486 TK10485M FM IF detector for cordless phones OPA 37U TK10487M TK16202U 130mvrms TK10485 10483z
Contextual Info: TOKO AMERICA INC 54E D ^Ob7b3S 0001=133 bbT • TAI TOKO INTEGRATED CIRCUITS ib ib ICs for Communications Equipment ic Operating voltage V Package 9 .5 - 1 0 .5 U-6 • • Surface Taping Mounting equip. Circuits and functions Production 3 < Video equip.

NJU3427

Abstract: NJU3427 E NJU3427F IC NJU3427F dr26 QFP52-A2 DR31 DR25 Diode Datasheet DR34 DR35
Contextual Info: Preliminary NJU3427 36 Outputs VFD Controller/Driver Package GENERAL DESCRIPTION The NJU3427 is a 36-output VFD Vacuum Fluorescent Display controller/driver. The NJU3427 consists of high-voltage driving circuit, Timing/ Segment driver select circuit, display data RAM

LQFP64. footprint

Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Contextual Info: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is

SIEMENS AVR GENERATOR

Abstract: philips dect Siemens metro brazil 80CL51 philips rf manual 80C51 PCD5032 PCD5093 PCD5093H PCD5096
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PCD5093 DECT baseband controller Objective specification File under Integrated Circuits, IC17 1997 Jul 21 Philips Semiconductors Objective specification DECT baseband controller PCD5093 CONTENTS 1 FEATURES 1.1 DSP software features

vcd player block diagram

Abstract: block diagram of VCD block diagram of VCD and its functions colour tv power supply system ic SAA7185 circuits video player circuit diagram CCIR601 CCIR656 DR14 QFP100
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA2510 Video CD VCD decoder Preliminary specification File under Integrated Circuits, IC02 1996 May 21 Philips Semiconductors Preliminary specification Video CD (VCD) decoder SAA2510 FEATURES (With standard microcode loaded)