QFN77 Search Results

Contextual Info: Reportable Substances in Components Package Type : QFN77 Component Weight : Document No : QFN77-44LD-PBY-RS-1 Process Type : Standard D/A & Lead Free Finish 0.1276 grams 7.0mmx7.0mm Lead #: No 1 2 3 4 5 6 7 44LD Material Content in % Molding Compound 48.03%

Contextual Info: Reportable Substances in Components Package Type : QFN77 Component Weight : Document No : QFN77-48LD-GRN-RS-3 Process Type : Standard D/A & NiPdAu Lead Finish 0.1311 grams 7.0mmx7.0mm Lead #: No 1 2 3 4 5 6 7 48LD Material Content in % Molding Compound 47.96%

Contextual Info: Reportable Substances in Components Package Type : QFN 44 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 080911PM10 Content in % 62.43%

202328A

Abstract: P10 led module CONNECT HEADER 5X2 1N4148 LL4148-1 HRP10H-ND SMD HEADER 5X2 max2850 AAT2428
Contextual Info: EVALUATION BOARD DATA SHEET EV191 Evaluation Board for the AAT2428 Sixteen-Channel White LED Driver Solutionwith LED Current and Timing Control Introduction The AAT2428 evaluation board is a hardware platform to evaluate the functions of the AAT2428, a 16-channel white

202321A

Contextual Info: EVALUATION BOARD DATA SHEET EV187 Evaluation Board for the AAT2469/2499 Sixteen-Channel TVLite White LED Driver Solutionwith LED Current and Timing Control Introduction The AAT2469/AAT2499 evaluation board is a hardware platform to evaluate the functions of the AAT2469 and AAT2499

LQFP-128L

Abstract: LQFP128L
Contextual Info: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER

Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Component Weight : QFN 7x7mm Document No : 84 Process Type : Content in % Molding Compound 70.09% Copper Alloy Frame 15.36% Spot Silver Plating 0.07% Silver Die Attach Epoxy