nitto GE
Abstract: GE-7470L-A G770H GE-74 sumitomo g770h GE mold compound Nitto HI-3582PCI-10 mold compound 7470-LA
Contextual Info: Assembly Location and Mold Compound Change for QFN Packages Product Change Notice PCN0806 v1.0 September 12, 2008 Overview This notice describes two changes to the ARINC 429 and MIL-STD 1553 family of devices which are manufactured in QFN packages: o Assembly plant location change for all QFN Packages (40PCS, 44PCS, and 64PCS) from current CARSEM,
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40pcs44pcs64pcsge-7470l-a+13pcn0806jesd46-cqr-8033qfn-64nitto geg770hge-74sumitomo g770hge mold compoundnittohi-3582pci-10mold compound7470-la
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