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    MF1MOB6S50 Search Results

    MF1MOB6S50 Datasheets (1)

    NXP Semiconductors
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    MF1MOB6S50/D,118
    		NXP Semiconductors MF1MOB6S50/D - MF1ICS50 Functional specification, SOT500-3 Package, Standard Marking, Reel Pack, SMD, 13" Original PDF 156.27KB 20

    MF1MOB6S50 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Mifare MOB6 module package

    Abstract: mob6 package Contactless Smart Card Module Specification MOB6 nxp MOB6 mob6 package NXP MOB6 nxp MF1MOB6S50 SOT500-3 pllmc SOT500-3 package outline
    Contextual Info: MF1MOB6S50 Contactless chip card module specification Rev. 3.0 — 14 December 2009 179430 Product data sheet addendum PUBLIC 1. Introduction This document specificies the characteristics of the MF1MOB6S50 product. The MF1MOB6S50 product consists of the integrated circuit M1ICS50 packaged into the


    Original     		mf1mob6s50m1ics50ot500db3mf1ics50+9mifare mob6 module packagemob6 packagecontactless smart card module specification mob6nxp mob6mob6 package nxpmob6 nxpsot500-3pllmcsot500-3 package outline PDF

    BLF4G08LS-160A

    Abstract: J3A080GA4/T0BG1610 MARKING S08 NXP TJA1050T-CM,11 power+wizard+1.1+fault+codes SCC2691AC1A28 IP5004CX6 TDA8275AHN/C1,557 H3-BGA3XX_11 BZA456A
    Contextual Info: NXP Semiconductors Product Discontinuation DN66 June 30, 2010 SEE DN66 NOTICE LETTER FOR APPLICABLE LAST TIME BUY TERMS, CONDITIONS AND CODE DEFINITIONS FOR THESE DISCONTINUED PRODUCTS. FOR ADDED INFORMATION, REFER TO NXP WEB-SITE "http://www.nxp.com/products/eol/"


    Original     		31-dec-1030-jun-11uba2074at/n1uba2074t/n1+1231-mar-11uba2074ts/n1blf4g08ls-160aj3a080ga4/t0bg1610marking s08 nxptja1050t-cm,11power+wizard+1.1+fault+codesscc2691ac1a28ip5004cx6tda8275ahn/c1,557h3-bga3xx_11bza456a PDF