MB160 Search Results

Contextual Info: SPECIFICATION FOR APPROVAL REF : PAGE: 1 PROD. ABC'S DWG NO. MULTILAYER CHIP BEAD NAME MB1608□□□□5□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： A D C H D I B G I PCB Pattern Unit : m/m Series MB1608 A 1.60±0.15 C D G H I 0.80±0.15 0.30±0.20

Contextual Info: SPECIFICATION FOR APPROVAL REF. : PROD. High Current Multilayer Chip Bead MB□□□□□□□□L□-□□□ ABC'S DWG NO. NAME 20130819-D REV. PAGE 1 Ⅰ﹒Configuration and dimensions： A D H C D B I G I Unit：m/m PCB Pattern Series MB2029 MB1608

Contextual Info: PRODUCT MB1608H-600-0.5A-LF SPEC.NO. C-1316-041 00 COIL SPECIFICATION DATE 2006/12/1 CODE NO. C01316041 CONFIGURATION & DIMENSIONS ︰ A ： 1.6±0.15 m/m B ： 0.8±0.15 m/m C ： 0.2~0.6 m/m D ： 0.8±0.15 m/m ELECTRICAL CHARACTERISTIC： IIMPEDANCE (Ω) AT 100 MHz 500mV：

SB150

Abstract: SB160 SR106 SS16
Contextual Info: MB160S SCHOTTKY DIE SPECIFICATION Revision 3 5/25/2000 General Description Low Ir 60V 1A Single Anode ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Average Rectified Forward Current Ir = 0.1 mA Maximum Instantaneous Forward Voltage @ 1 Amperes, 25 0 SYM

Contextual Info: Coilmaster Coilmaster Electronics Co., Ltd. E-mail :info@coilmaster.com.tw Web Site : www.coilmaster.com.tw 9F-3 No.398, Huan Bei Rd. Chung Li City, Taoyuan 320, Taiwan Tel : +886-3-422-8279 Fax : +886-3-422-8734 MB1608 SERIES PART NUMBERING SYSTEM MB TYPE

mb160

Abstract: Schottky diode Die SB150 SB160 SR106 SS16 s5727
Contextual Info: MB160 SCHOTTKY DIE SPECIFICATION Revision 3 5/25/2000 General Description Low Ir 60V 1A Single Anode ELECTRICAL CHARACTERISTICS DC Blocking Voltage: Average Rectified Forward Current Ir = 0.1 mA Maximum Instantaneous Forward Voltage @ 1 Amperes, 25 0 SYM Spec.

mb160808

Abstract: 100MHZ 200MHZ impedence electrodes MB-321611 Productwell Precision Elect
Contextual Info: MB SERIES MULTILAYER CHIP BEADS MECHANICALS l FEATURE 1. The small size chips generating high impedance. 2. Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. 3. High reliability due to an entirely monolithic structure

MB1700

Abstract: E128 flip-flop
Contextual Info: February 1990 Edition 1.1 - D A TA S H E E T E128H, E32, E128 Ultra High Performance ECL Gate Arrays DESCRIPTION T h e F u jitsu U ltra H ig h P e rfo rm a n c e E 128, E 32, a n d E 1 2 8 H E C L g a te a rra ys o ffe r th e h ig h e st spee d p e rfo rm a n c e a va ila b le fro m a n y F ujitsu array. G a te

1MBI600S-120

Contextual Info: This material and tie ‘nhrmation herein 3s (he properly cf Fcji Electric Ca.UcJJhcy shall be nelihor nproducoa, copied. Icti. or disclosed n any wav whatsoever (or the use of any third psny.nc: used (or the manufacturing purposes without fha expross wtlncn consem of Fuji Siectrlc Co. Lid.

Contextual Info: SPECIFICATION FOR APPROVAL REF : 20100706-C PROD. NAME PAGE: 1 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： H A D D C I G I PCB Pattern B Unit : m/m Series A

VOGT 545 02 082 00

Abstract: vogt 545 13 084 00 545 02 082 00 vogt vogt -sumida 575 26 sumida 94V-0 VOGT N1 50 545 42 045 00 vogt 545 13 084 vogt 545 23 194 00 SM3261-L 570 16 390 10, VOGT
Contextual Info: Продукция компании ABC TAIWAN ELECTRONICS CORP. ИНДУКТИВНОСТИ SMD ПРИБОР-СИСТЕМЫ Телефон/факс: +7 495 105 00 91(многоканальный) Телефон/факс: +7 (495) 784 61 69(многоканальный)

FD31N

Abstract: DRF20-S MB1700 mb160 FD11P ECL IC NAND
Contextual Info: FUJ I TS U M I C R O E L E C T R O N I C S 374=i7b2 OOmSRM R E l FMI 31E S February 1990 Edition 1.1 FUJITSU DATA S H E E T • E128H, E32, E128 Ultra High Performance ECL Gate Arrays DESCRIPTION The Fujitsu Ultra High Performance E128, E32, and E128H ECL gate arrays

prescalers

Abstract: BINARY prescalers 10 54095 MB1506
Contextual Info: SECTION 4 Super PLLs SingleChip PLLs/Prescalers - A t a Glance Fujitsu is one of only a few semiconductor manufacturers to offer single-chip PLL/Prescaler devices and was the creator of the industry standard MB 1501. These devices are manufactured using an advanced

MB-321611-0080HD

Abstract: MB-160808-0025HD MB-201209-0010ND MB-160808-0030NS 0/ROBERTS MB MB322513 MB-321611-0300NR mb160808 MB321611-0031NP MB316
Contextual Info: HOUSING TECH. CORP. FERRITE CHIP BEAD MB TYPE MB TYPE PRODUCT IDENTIFICATION 1. PORDUCT SYMBOLE MB - 160808 - 0600 N 1 2 3 4 P 2. DIMENSION 5 3. IMPEDANCE 4. TYPE (N: GENERAL CURRENT) 5. MATERIAL (D, E, F, P, R, S) SHAPES, DIMENSIONS & RECOMMENDED PATTERN

MB2029

Abstract: MB4532700 20100407-B MB2029300YL mb160 MB3261
Contextual Info: SPECIFICATION FOR APPROVAL REF : 20100407-B PROD. NAME PAGE: 1 ABC'S DWG NO. HIGH CURRENT MULTILAYER CHIP BEAD MB□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： H A D D G C I I PCB Pattern B Series MB4532 MB4516