JEDEC100 Search Results
JEDEC100 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: YAMAICHI Q.F.P. Production Sockets Body M aterial: Polyphenylene Sulfide PPS Contact M aterial: Beryllium Copper (BeCu) Contact Plating; Tin over Nickel Mating Package: JEDEC100 pin Bumpered QFP IC157-100-001-SS4 • CHARACTERISTICS Insulation Resistance |
OCR Scan |
jedec100ic157-100-001-ss4500mo500vdc+2 | |
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Contextual Info: YAMAICHI ELECTRONICS INC 0QG0S7Ö SSfl • bflE D YAMAICHI IC157-100-001-SS4 Q.F.P. Production Sockets RECOMMENDED PC BOARO LAYOUT 10* V « W M U M SOCKET 1 D0- *0. ss talsrttr jjf H; =1 “ Bodv Material : Polyphenylene Sulfide PPS Contact Material: Beryllium Copper (BeCu) |
OCR Scan |
ic157-100-001-ss4jedec100500mq500vdc+2 | |
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Contextual Info: YA HA IC HI E L E C T R O N I C S Q.F.P. SMT INC bflE D TTHSSati D O D G S ? 1! MTM YAMAICHI IC198 Series + 0.05 I SPE C IF IC A T IO N S • Low profile 4.0mm. Easy for ROM upgrade. • SMT terminals • C H A R A C T E R IS T IC S Insulation Resistance |
OCR Scan |
ic198ic157-100-001-ss4jedec100500mq+3 |