IGC109T120T8RM Search Results
IGC109T120T8RM Price and Stock
Infineon Technologies AG IGC109T120T8RMX1SA2- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC109T120T8RMX1SA2) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC109T120T8RMX1SA2 | Waffle Pack | 40 Weeks | 2,016 |
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IGC109T120T8RM Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
IGC109T120T8RMContextual Info: IGC109T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Chip Type |
Original |
igc109t120t8rml7742ul7742o | |
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Contextual Info: IGC109T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Chip Type |
Original |
igc109t120t8rml7742ul7742o | |
|
Contextual Info: IGC109T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Chip Type |
Original |
igc109t120t8rml7742ul7742o |