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    IDG-1150 Search Results

    IDG-1150 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-806261150LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. PDF
    54121-105091150LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch. PDF
    54112-811502400LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch. PDF
    54112-419221150LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Stacking vertical header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch. PDF
    54242-806101150LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. PDF
    SF Impression Pixel

    IDG-1150 Price and Stock

    TDK Invensense

    TDK Invensense IDG-1150

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