HVQFN88 Search Results

Contextual Info: Package outline HVQFN88: plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm A B D SOT906-5 terminal 1 index area E A A1 c detail X e1 Du Ds Dr Dq C e L v w b 23 44 22 M e Es Ej e2 Eh Er Em Eu 1/2 e Ev 66 1

Contextual Info: Package outline HVQFN88: plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm B D SOT906-1 A terminal 1 index area A E A1 c detail X e1 e 23 1/2 e v w b 44 L M M C C A B C y y1 C 45 22 e Ek e2 Ej Eh 1/2 e 1 terminal 1

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN88 package SOT906-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout