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    Contextual Info: 635m m HIE233SH 3 Materials: M a te s w ith : MIT • «fi >i Ü a intfh Discrete ground plane every 12, 70mm .500" li : Up to 266 signal leads Ground plane soldered to plated-through hole for added PCB retention Insulator Material: Liquid C iystal Polym er


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    HIE233SH 1-800-SAM PDF