FD1631 Search Results

FD1631

Contextual Info: Difference of phase EHF FD1631 for PCS 50Ω / 50Ω Dual BALUN 1 ) 180 Phase ( 90 2 1 -90 Frequency 1930 1990 MHz 2 -180 Insertion loss / PC 3.28 3.36 Difference of phase 176.5 177.2 8.7 8.9 Return loss (Input 50 Ω port) dB dB 1910 Insertion loss is inclosed divided loss 3dB.

Contextual Info: Difference of phase EHF FD1631 for DCS 50Ω / 50Ω Dual BALUN 1 ) 180 Phase ( 90 2 1 -90 Frequency 1805 1880 MHz 2 -180 Insertion loss / PC 3.86 3.80 Difference of phase 191.1 192.1 6.3 6.2 Return loss (Input 50 Ω port) dB dB 1792 Insertion loss is inclosed divided loss 3dB.

1805-1880Mhz

Contextual Info: EHF FD1631 Dual Balun [Dimensions] unit : mm 8-R0.16 8 7 6 5 1 2 3 4 1.6+-0.2 0.32 0.96 0.32 0.48 No. 1 2 3 4 5 6 7 8 <Top & Side View> 0.65+-0.1 <Bottom View> [Pin Assignment] 0.4 0.8 3.2+-0.2 IN 2 GND NU OUT 2 OUT 1 NU NU IN 1 NU : None Use Terminal [Characteristics] Ta=250C

FD19

Abstract: BY12 FA147
Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Phoenix/MPC8260 SDRAM Timing Diagram

Contextual Info: White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: WEDPNF8M721V-XBX 8Mx72 Synchronous DR AM + 8Mb Flash Mix ed Module DRAM Mixed MultiChip PPackage ackage ADVANCED* Multi-Chip n FEATURES n • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

FD19

Abstract: FD31 FD23 WEDPNF8M722V-XBX
Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

FD31

Abstract: WEDPNF8M721V-XBX
Contextual Info: WEDPNF8M721V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

WEDPNF8M721V-XBX

Abstract: WEDPNF8M722V-XBX
Contextual Info: White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm