FD1622 Search Results

Contextual Info: EHF FD1622 1:4 Balun [Pin Assignment] [Dimensions] unit : mm 0.48 4 3 1 2 No. 1 2 3 4 1.6+-0.2 0.32 0.96 0.32 4-R0.16 <Top & Side View> 0.65+-0.1 <Bottom View> 0.4 0.8 IN OUT 1 OUT 2 GND 1.6+-0.2 [Characteristics] Ta=250C Frequency Insertion Loss Phase Impedance

Contextual Info: Difference of phase EHF FD1622 50W / 200W BALUN 1 ) 180 Phase ( 90 1 2 -90 Frequency 700 900 MHz 2 -180 Insertion loss / PC 0.88 0.86 Difference of phase 181.6 180.6 Return loss (Input 50 W port) 12.5 13.0 dB dB 500 Insertion loss (Back to back) 900 1300

WEDPNF8M722V-XBX

Contextual Info: White Electronic Designs WEDPNF8M722V-XBX 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n Sector Architecture •One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

FD19

Abstract: BY12 FA147
Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

FD19

Abstract: FD31 FD23 WEDPNF8M722V-XBX
Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: White Electronic Designs WEDPNF8M722V-XBX 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n Sector Architecture •One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

WEDPNF8M722V-XBX

Contextual Info: WEDPNF8M722V-XBX 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* n Sector Architecture FEATURES n •One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm