E2799 Search Results

Contextual Info: E2799/E2799LF SONET Minimum Clock ISSUE4 :13 JUNE 2005 N o m in al Frequency, Fo • 12.8MHz ■ RoHS/Soldering: Parts w ith th e su ffix 'LF' on the part n um ber are fu lly co m p lia n t w ith the European Union d irective 2002/95/EC on th e restriction o f th e use o f

c-mac

Contextual Info: E2799 SONET Minimum Clock ISSUE 3; 19 OCTOBER 2004 Nominal Frequency, Fo • ■ Solderability: MIL-STD-202, Method 208, Category 3 ■ Resistance to Soldering Heat: 260°C / 10s exposure ■ Marking: Laser Marked 12.8MHz Marking 3.3V ±5% Input Current ■

RAKON

Abstract: 12,8MHz E2799LF
Contextual Info: E2799 SMD TCXO SONET Outline mm 7.0±0.15 Supply Voltage 5 9 0.6 Underside View 0.81 2.03 0.80 4 7.11 ▪▪ Loose in bulk pack, 10pcs per pack ▪▪ Tape and reel in accordance with EIA-481-D, 1kpcs per reel Input Current (please see pages 372 & 373) ▪▪ ≤4mA

c-mac

Contextual Info: E2799/E2799LF SONET Minimum Clock ISSUE 4 ; 13 JUNE 2005 • Nominal Frequency, Fo ■ 12.8MHz Supply Voltage ■ Note: The RoHS compliant parts are suitable for assembly using both Lead-free solders see Lead-free Reflow soldering profile and Tin / Lead solders (see Tin / Lead

e78996 india

Abstract: E78996 rectifier module F350 IRFK3D350 IRFK3F350 E2799
Contextual Info: Bulletin E2799 International IïôrI Rectifier IRFK3D350,IRFK3F350 Isolated Base Power HEX-pak Assembly - Half Bridge Configuration • • • • H igh C urrent C apability. UL re cognised E 78996. E lectrically Isolated B ase Plate. E asy A s s e m b ly into E quipm ent.

E2799

Abstract: SEMTECH MARKING
Contextual Info: E2799 SONET Minimum Clock M i c r o Te c h n o l o g y ISSUE 2; 1 MAY 2002 Nominal Frequency, Fo 12.8MHz Supply Voltage • Resistance to Soldering Heat: 260°C / 10 seconds exposure ■ Marking: Laser Marked Marking 3.3V ±5% Input Current ■ Solderability: MIL-STD-202, Method 208, Category 3

c-mac

Contextual Info: E2799/E2799LF SONET Minimum Clock ISSUE 4 ; 13 JUNE 2005 • Nominal Frequency, Fo ■ 12.8MHz Supply Voltage ■ Note: The RoHS compliant parts are suitable for assembly using both Lead-free solders see Lead-free Reflow soldering profile and Tin / Lead solders (see Tin / Lead

IRFK3F350

Contextual Info: INTERNATIONAL RECTIFIER bSE J> 4055452 0Dlb245 430 IN R Bulletin E2799 International S Rectifier IRFK3D350JRFK3F350 Isolated Base Power HEX-pak Assembly - Half Bridge Configuration • • • • High Current Capability. UL recognised E78996. Electrically Isolated Base Plate.

SEMTECH code date MARKING format

Abstract: smd marking code 711
Contextual Info: E2799 SMD TCXO SONET ISSUE 6; 1 NOVEMBER 2008 Outline mm Description use in SONET applications, manufactured for us by Rakon utilising their Pluto ASIC technology 7.0±0.15 2.0 Max 0.80 Package Outline Solder Pad Layout 2.54 Holdover Stability [±(Fmax-Fmin)/2Fo]