DPS128C32BV3 Search Results
DPS128C32BV3 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| DPS128C32BV3 | DPAC Technologies | 512K x 8 High Speed CMOS SRAM | Original | 778.05KB | 7 |
DPS128C32BV3 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
DPS128C32BV3Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic |
OCR Scan |
DPS128C32BV3 DPS128C32BV3 500mV 00012flb 30A044-28 | |
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Contextual Info: _ DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CM O S SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 "VERSA-STACK" m odule is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless |
OCR Scan |
DPS128C32BV3 DPS128C32BV3 | |
DPS128C32BV3Contextual Info: 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. |
Original |
DPS128C32BV3 DPS128C32BV3 30A044-28 | |
DP5ZContextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS |
OCR Scan |
128Kx8, 64Kx16, 256Kx8, 384Kx8, DP5Z |