DPD32M Search Results

Contextual Info: DENSE-PAC 1024 Megabit CMOS DRAM MICROSYSTEMS DPD32MS32PW5 PRELIMINARY PIN-OUT DIAGRAM D ESC R IPT IO N : The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Sup er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks

e351

Abstract: DPD32
Contextual Info: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PW 5 _ PRELIMINARY_ D E S C R IP T IO N : The D P D 32M S40 PW 5 is the 32 M eg x 40 Dynamic RAM module in the family of Super SIM M modules that utilize the new and innovative space saving TSO P

Contextual Info: DENSE-PAC o vi i c R 1024 Megabit CMOS DRAM DPD32MS32RW s y s r i: m s DESCRIPTION: The DPD32MS32RW is the 32 Meg x 32 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of sixteen 16M x 4 dynamic RAM surface mounted on an industry standard 72-pin

Contextual Info: 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks

Contextual Info: DENSE-PAC o vi i c R 1152 Megabit CMOS DRAM DPD32MS36RW s y s r i: m s DESCRIPTION: The DPD32MS36RW is the 32 Meg x 36 Dynamic RAM module in the family of JEDEC Standard modules that utilize the space saving TSOP technology. The module is constructed of sixteen 16Mx4 dynamic RAMs and eight 16 Meg x 1 Dynamic RAM's

Ka-52

Abstract: D32M
Contextual Info: DENSE-PAC 1152 Megabit CMOS DRAM MICROSYSTEMS DPD32MS36PW5 P R ELIM IN A R Y D E S C R IP T IO N : The DPD32M S36PW 5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks

Contextual Info: 128 Megabit CMOS DRAM D E N S E -P A C m i e R e s y s t e m s : DPD32MX4PY5 PRELIM INARY DESCRIPTION: The DPD32MX4PY5 is the 32 M e g x4 Dynamic RAM module that utilizes the new and innovative space saving TSOP stacking technology. The module is constructed of eight 16

1s311

Contextual Info: DENSE-PAC 1280 Megabit CMOS DRAM DPD32MX40PKW5 M ICRO SYSTEM S PRELIMINARY D ESC RIPT IO N : The DPD32M X40PKW 5 is the 32 Meg x 40 ECC Dynamic RAM module in the family of SuperSIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twenty-four dynamic RAM stacks

RA3045

Abstract: DQ2451
Contextual Info: DENSE-PAC MICROSYSTEMS 1024 Megabit CMOS DRAM DPD32MS32PKW5 PRELIMINARY D ESCRIPTIO N : The DPD32MS32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Su p er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks

Contextual Info: DENSE-PAC o vi i c R 1280 Megabit CMOS DRAM DPD32MS40RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD32MS40RW is the 32 Meg x 40 ECC Dynamic RAM modules that utilize the space saving TSOP stacking technology. The module is constructed of twenty 16M x 4 dynamic RAM's surface mounted on an industry standard 72-pin SIMM

KA51

Contextual Info: DENSE-PAC 1024 Megabit CMOS DRAM MICROSYSTEMS DPD32MS32PW 5 ADVANCED INFORMATION PIN-OUT DIAGRAM DESCRIPTION: The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the fam ily of S uper SIMM modules that utilize the new and innovative space saving TSOP

11kO

Contextual Info: DENSE-PAC MICROSYSTEMS 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY D E S C R IP T IO N : PIN-OUT DIAGRAM The DPD32M536PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of S u p e rS IM M modules that utilize the new and innovative space saving TSOP

simm 72 dram

Abstract: SIMM 80 jedec transistor C 2240 TT 2240
Contextual Info: 1024 Megabit CMOS DRAM DPD32MS32PW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks

Contextual Info: 1024 Megabit CMOS DRAM DPD32MS32PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks

Contextual Info: 1152 Megabit CMOS DRAM DPD32MS36PW5 PRELIMINARY DESCRIPTION: The DPD32MS36PW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks

Contextual Info: DENSE-PAC 1152 Megabit CMOS DRAM DPD32MX36PKW5 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPD32MX36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of SuperSlM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twenty-four dynamic RAM stacks

Contextual Info: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PKW5 PRELIMINARY D ESCRIPTIO N : The DPD32MS40PKW5 is the 32 Meg x 40 Dynamic RAM module in the family of S u p e r S IM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks,

MA3280

Abstract: ua3680
Contextual Info: 1280 Megabit CMOS DRAM DPD32MS40PKW5 PRELIMINARY DESCRIPTION: The DPD32MS40PKW5 is the 32 Meg x 40 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks,

A273D

Abstract: 16J3 512X32 48pin
Contextual Info: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32

256KX8 SIMM

Abstract: 512kx8 dram simm dram zip 256kx16 1mx8 DPS 119 61 sram 256kx8
Contextual Info: TABLE OF CONTENTS GENERAL PRODUCT INFORMATION Reference by S iz e . 4 Dense-Pac Microsystems Modules and M onolithics. 5