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68001-232HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 32 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68031-232HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. |
PDF
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68021-232HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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DLP650LNIRFYL
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Texas Instruments
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DLP 0.65 NIR WXGA S450 DMD 149-CLGA 0 to 70 |
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TM4C1232H6PMI7
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Texas Instruments
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High performance 32-bit ARM® Cortex®-M4F based MCU 64-LQFP -40 to 85 |
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