DC37STII Search Results

DM51157-8

Abstract: 12f 5091 DM53740-5001 dm53740-16 DM53742-18 DM53742-5001 M24308/25-9F DCMA-37P CET-C6B M24308/24-25f
Contextual Info: D-SUBMINIATURE D*KL Series HTD/HPD Series D*A Series Overmold Kits D*U Series T* Series Basic D Series Series 1 - High Reliability Series 3 - High Reliability M24308 Series Backshells/Junctionshells/Hoods Accessories Application Tooling D-subminiature Connectors

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

Contextual Info: D-subminiature Metal Shell Solder Cup, Vertical PCB Mount, and Wire Wrap Basic D Series • Offered in Wire Wrap and Solder Cup styles for wire termination and vertical style for PCB mount. FEATURES ■ Offered with .120 mounting holes, 4-40 clinch nuts, and dual float bushings.

DB 15P Female 90 DIP Connector

Abstract: D-20419-16 DM53752-8 DCMA-37S dem 9p connector DC-37PTI F-179 db-60-20 SCREWLOCK male M24308/2-4f backshell
Contextual Info: D-subminiature Metal Shell Solder Cup Basic D Series Ordering Information Solder Cup Sockets Zinc-Plated Shell with Yellow Chromate Finish Stamped Contact with Gold Flash in Solder Cup Mounting Holes 4-40 Clinch Nuts Positions Gold Flash 30µin. Gold Gold Flash

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

M24308-1-3

Abstract: Cinch db25 Connectors dbc25p DB-51212-1 DEU9SFO "D-Subminiature Connector" 62 Pin High Density EP-580 ne 5532 dd dbc-25p m24308-2-5
Contextual Info: D-SUBMINMTURC D *K l Series HTD/HPD Series D*R Series Overmold Kits D*U Series T* Series Basic D Series Series 1 - High Reliability Series 3 - High Reliability M24308 Series Backshells/Junctionshells/Hoods Rccessories Rpplication Tooling C inch D-subm iniature

Contextual Info: D-subminiature Metal Shell Solder Cup Basic D Series • Available with stamped or machined contacts. • Will accommodate up to 20 AWG wire. Cinch Materials • Contact Material: Copper Alloy • Contact Plating: - Stamped contacts with gold flash or 30pin. gold in mating area, gold flash or tin/lead on remainder. All over nickel.

DBE-25P-F179C

Abstract: DE-9P-F179C-30 DC-37S DA-15PS DB-25S-F179 DB-25PVTI DB25SVT DC37PV DE-9S-F179C-30 clinching nut
Contextual Info: D-subminiature Metal Shell Solder Cup, Vertical PCB Mount, and Wire Wrap Basic D Series • Offered in Wire Wrap and Solder Cup styles for wire termination and vertical style for PCB mount. FEATURES ■ Offered with .120 mounting holes, 4-40 clinch nuts, and dual float bushings.