CT640 Search Results

t245A

Contextual Info: TC74HCT245AP/AF CT640AP/AF TC74HCT643AP/AF OCTAL BUS T R A N S C E I V E R TC74HCT245AP/AF 3 - S T A T E ,N O N -IN V E R T IN G CT640AP/AF 3-S TATE, IN V E R T IN G TC74HCT643AP/AF 3 -S T A T E ,IN V E R T IN G A N D N O N - I N V E R T IN G T h e TC74H C T245A , H CT640A a n d H C T643A a re h ig h

Contextual Info: H D74H CT640,H D74H CT643 Both the CT640 and the HD74HCT643 have one active low enable input G , and a direction control (DIR). When the DIR input it high, data flow * from the A inputs to the 6 outputs. When DIR is low, data flows from B to A. The CT640 transfers inverted data from one bus to

74HC4096

Abstract: EQUIVALENT TIMER IC WITH CD 4060 rs flip-flop IC 7400 C4050A shiftregister PIPO C148A LS 7476 L1AA C4051A LS294
Contextual Info: Selection Guide C2MOS Logic TC74HC/HCT Series 2. High Speed CMOS Selection Guide GATE NAND HCOOA NOR AND OR INVERTER, BUFFER EXCLUSIVE OR/NOR SC HM ITT TRIGGER HC02A HC08A H C31A H C04A H C86A H C14A H C51A H C4049A M ULTI FUNCTION LEVEL SHIFTER HCTOOA HCT02A

20035

Contextual Info: NDTESi PINS NDT E L E C T R IC A L LY CDNNECTED ARE DMITTED. E LEC TR IC A L SPECIFICATIONS' 1.0 INDUCTANCE' P 1 -J1 = P 2 -J2 P 4 - J 4 = P 5 - J 5 i 65 uH 0.01V, 10 KHz, nominal. 2.0 DC RESISTANCE' 3.0 P l- J l i .5 ohm MAX P 2 -J2 i .5 ohm MAX P 4 -J4

Contextual Info: 2 REV ECN APP'D. BY 1/24/06 DATE A6 7448 JM 3/24/08 A7 8388 JM 2/06/09 A8 8652 TA B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY — SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP’D. BY 1 1 -1 0 -0 6 A3 7820 TRM 1 1 -1 6 -0 6 A4 7832 TRM 5 -2 2 -0 9 A5 8741 TRM -.5 30 [13.46] MAX.- STEW ART PATENTED !7I y .400 [10.16]- .100 [2.54] NOTES: .050 [1.27] 3 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 .125 [3.18]

Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR 022-01.

Contextual Info: B DATE REV ECN APP’D. BY 1/24/06 B5 7448 JM B .850 [21.59] M A X- -H NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY .040 [1.02]— SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: HITACHI/ L O G I C / A R R A Y S / M E N 'ÎH D eJ 44^203 DOlObbb Q 10666 d 7 "-S 2 -3 Ì 92D CT640,HD74HCT643 Both the CT640 and the HD74HCT643 have one active low enable Input G , and a direction control (D IR ). When the DIR Input li high, data flow i from the A Inputi

Contextual Info: 2 DATE REV ECN APP'D. BY 1/24/06 C2 7448 JM B -.4 50 [11.42]- NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .100 [2.54] 3 SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A4 7448 JM B B -.8 50 [21.59] M A X- □ NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .040 [1.02]— —

Contextual Info: DATE REV ECN APP’D. BY 1/24/06 B4 7448 JM B B -.850 [21.59] M AX- V 71 □ NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA .040 [1.02]— -

Contextual Info: DATE REV ECN APP'D. BY 1/24/06 AO 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR 022-01.

Contextual Info: DATE REV ECN APP'D. BY 1/24/06 A3 7884 JM .530 [13.46] MAX.- B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY -.400 [10.16]- SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A4 7448 JM B B —— *.635 [16.13] MAX— NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY 08277204 SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

pa 605

Contextual Info: DATE REV ECN APP’D. BY 1/25/06 AO 7455 JM B B in o m NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.

PTI 30 040 pa

Abstract: JM0-00 SS-6466S-A-PG4-BA CT640172
Contextual Info: DATE REV ECN APP'D. BY 1/25/06 A1 7455 JM B B SUGGESTED PANEL OPENING NOTES: 1 . CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP'D. BY 11-4-05 EO 7369 TRM 1-13-06 E1 7437 JM B B N0TES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP’D. BY 1/30/06 A1 7455 JM -.850 [21.59] MAX- B \ /I B O O A00 om m NOTES: — .040 [1.02] - . 4 2 5 [1 0 .7 9 ]- 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

M-SIA

Abstract: CT640068
Contextual Info: DATE REV ECN 1/24/06 C2 7448 JM 1 1 -2 0-0 6 C3 7830 TRM APP'D. BY -.605 [15.37] MAX.- ¿ñ ci o. o o o CM O O OO ID O B B NOTES: — I m I— .100 [2.54] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN

SC CONNECTOR DRAWING

Abstract: 26 contacts connector 2.54 7448
Contextual Info: DATE REV ECN APP'D. BY 1/24/06 A2 7448 JM B B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER 2. FOR PRODUCT SPECIFICATIONS SEE PR022-01.

Contextual Info: REVISID N CHANGES tewüffU ©mttgtoir lim, „ T , ,h v j " j " j " j " j " j " j " j " j " " j " j NEW FORMAT B1 11118 Susquehanna Trail South Glen Rock, PA 1 7 3 2 7 -9 1 9 9 7 1 7 2 3 5 -7 5 1 2 Fax: (717) 2 3 5 -7 9 5 4 PART NO. S S —6488S—A—NF—SBOO

CI 545

Abstract: date sheet for b.a part 111
Contextual Info: .635 [16.13] MAX.- DATE REV ECN APP'D. BY 9 -2 0 -0 5 A4 7285 TRM 11-11-05 A5 7375 TRM 1-26-06 A6 7467 JM 12-4-06 A7 7857 DHG E STEWART PATENTED B B mira -.450 [11.43]- NOTES: - .100 [2.54] 4 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS/SHIELD: COPPER ALLOY

7448

Abstract: SC CONNECTOR DRAWING CT640072
Contextual Info: DATE REV ECN APP’D. BY 1/24/06 A2 7448 JM B B NOTES: — 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER .050 [1.27] TYP