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    CP361R Search Results

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    CP361R Price and Stock

    AEM Central Semiconductor

    AEM Central Semiconductor CP361R-CEDM7001-CT

    100mA,20V Bare die,14.173 X 14.1
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CP361R-CEDM7001-CT Tray 400
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    CP361R Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CEDM7001

    Abstract: CMNDM7001
    Contextual Info: PROCESS CP361R Small Signal MOSFET N-Channel Enhancement-Mode MOSFET Chip PROCESS DETAILS Die Size 14.2 x 14.2 MILS Die Thickness 3.9 MILS Gate Bonding Pad Area 3.94 x 3.94 MILS Source Bonding Pad Area 3.94 x 7.08 MILS Top Side Metalization Al-Si - 30,000Å


    Original     		CP361R CEDM7001 CMNDM7001 CEDM7001 CMNDM7001 PDF