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    BGA324J Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    pitch 0.4mm BGA

    Abstract: 22X22 SF-BGA324J-B-11
    Contextual Info: C Package Code: BGA324J D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.508 mm


    Original     		bga324jfr4/g1022x22sf-bga324j-b-11+1pitch 0.4mm bga PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x PDF