pitch 0.4mm BGA
Abstract: 14X14 SF-BGA160C-B-11 0.4mm pitch BGA
Contextual Info: C Package Code: BGA160C D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.00mm [0.512"] X Top View (reference only) 1.00mm pitch typ. 0.53mm [0.021"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 2 0.53mm [0.021"]
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bga160cfr4/g1014x14allo24+3sf-bga160c-b-11pitch 0.4mm bga0.4mm pitch bga
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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BGA PACKAGE OUTLINE
Abstract: 14X14 1537M
Contextual Info: connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 2.09mm [0.082"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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fr4/g1014x14fx-bga160c/bga160c-01fx-bga160c/160c-01+2bga package outline1537m
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