|
MSP430F6458IPZ
|
|
Texas Instruments
|
MSP430F64xx Mixed Signal Microcontroller 100-LQFP -40 to 85 |
|
|
|
86092645814745ELF
|
|
Amphenol Communications Solutions
|
DIN Straight Header Solder-to-Board Style Q 64 ways, Class III |
|
|
|
86092645814755E1LF
|
|
Amphenol Communications Solutions
|
Header, Vertical, Through Hole, Style Q, 64 ways, Class Il |
|
|
|
86092645815765ELF
|
|
Amphenol Communications Solutions
|
DIN Straight Header Solder-to-Board Style R 64 ways, Class I |
|
|
|
67996-458HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in) Pitch |
|
|
|
86092645814755ELF
|
|
Amphenol Communications Solutions
|
Din Headers and Receptacles, Backplane connectors, Straight Header Solder-to-Board Style Q 64 ways, Class II, Tail Length: 4mm |
|
|
