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    ADCM-1650 Search Results

    ADCM-1650 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54121-108021650LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch. PDF
    54122-809401650LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch PDF
    54122-809041650LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch PDF
    54122-109041650LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch PDF
    54122-109221650LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch PDF

    ADCM-1650 Datasheets (1)

    Agilent Technologies
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    ADCM-1650-3011
    		Agilent Technologies CIF Resolution CMOS Camera Module Original PDF 183.89KB 16