AC322 Search Results

auris-GmbH

Contextual Info: Quartz SMD, Ceramic AC3225/4 Features: - SMD - ultra-thin and small leadless type - for high mechanical demands available Specifications Symbol f Äf/f CL AC3225 12.000MHz ~ 40.000MHz ±20ppm 10pF ~ series Storage temperature Äf/f TSTG ±20ppm ~ ±30ppm -55°C ~ +125°C

jedec package MO-247

Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Contextual Info: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB

Contextual Info: Quartz SMD, Ceramic AC3225/4 Features: - SMD - ultra-thin and small leadless type - for high mechanical demands available Specifications Symbol f ∆f/f CL AC3225 12.000MHz ~ 40.000MHz ±20ppm 10pF ~ series Storage temperature ∆f/f TSTG ±20ppm ~ ±30ppm

Contextual Info: Quartz SMD, Ceramic AC3225/4 Features: - SMD - ultra-thin and small leadless type - for high mechanical demands available Specifications Symbol f ∆f/f CL AC3225 12.000MHz ~ 40.000MHz ±20ppm 10pF ~ series Storage temperature ∆f/f TSTG ±20ppm ~ ±30ppm

JIS B1181

Abstract: B1181 TRANSISTOR b1181 AC229 B1251 B1256 spring washer b1257 AC331 ac332
Contextual Info: [ 6 ] Accessories [ 6 ] Accessories [ 6 ] Accessories When semiconductors are used, accessories are sometimes required. For these accessories, the numbers shown below the device dimensions on the technical data sheet are applicable. The uses of some typical accessories are shown in the illustrations below.