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Catalog Datasheet	Type	Document Tags	PDF
500gf Abstract: BGA package tray 40 x 40 foxconn Contextual Info: SPECIFICATIONS BGA 959 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 959 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500gf min. Electrical Contact Resistance : 25 mΩ max. Insulation Resistance: 1000mΩ min.	Original	13kgf 500gf 1000m 959pos +332x32 bga package tray 40 x 40 foxconn	PDF

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500gf

Abstract: BGA package tray 40 x 40 foxconn
Contextual Info: SPECIFICATIONS BGA 959 BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 959 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 500gf min. Electrical Contact Resistance : 25 mΩ max. Insulation Resistance: 1000mΩ min.

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13kgf 500gf 1000m 959pos +3

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