95390 Search Results

95390

Contextual Info: PD - 95390 IRFIB5N50LPbF SMPS MOSFET HEXFET Power MOSFET Applications • Zero Voltage Switching SMPS VDSS RDS on typ. Trr typ. ID • Telecom and Server Power Supplies 0.67Ω 500V 73ns 4.7A • Uninterruptible Power Supplies • Motor Control applications

95390

Contextual Info: PD - 95390 IRFIB5N50LPbF SMPS MOSFET HEXFET Power MOSFET Applications • Zero Voltage Switching SMPS VDSS RDS on typ. Trr typ. ID • Telecom and Server Power Supplies 0.67Ω 500V 73ns 4.7A • Uninterruptible Power Supplies • Motor Control applications

Contextual Info: PD - 95390 IRFIB5N50LPbF SMPS MOSFET HEXFET Power MOSFET Applications • Zero Voltage Switching SMPS VDSS RDS on typ. Trr typ. ID • Telecom and Server Power Supplies 0.67Ω 500V 73ns 4.7A • Uninterruptible Power Supplies • Motor Control applications

Contextual Info: 107-68043 Packaging Specification 20Mar2013 Rev AG SOCKET ASSEMBLY, DIMM 2P 1. PURPOSE 目的 Define the packaging specification and packaging method of SOCKET ASSEMBLY, DIMM 2P products. 订定SOCKET ASSEMBLY, DIMM 2P 产品之包装规格及包装方式。

6ES8

Abstract: EIA-364-TP-27
Contextual Info: CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc. It was performed in concurrence of Samtec Corporation of New Albany, IN who was the test sponsor. All equipment and measuring instruments used during testing

MA4E2502L

Contextual Info: V f lf c w H SurMount Chip Schottky Diodes SurMount Chip Surface Mount Monolithic Low Barrier Schottky Diodes M A 4 E 2 5 0 0 Series Features • Singles, Pairs, Ring and Crossover Quads • Reliable, Multilayer Metalization with a Diffusion Barrier, 100% Stabilization

Contextual Info: PROJECT NUE : REV. 9539 FRONT VIEW P in f Assignm ent 1 Right 2 Right sense 3 Left sense 4 Left Bottom 5 6 Bottom sense 7 Top sense 8 Top PINT iD 8 Pin 2 .5 4 m m Pitch Fem ale C on ne ctor 1 UV GLUE ITO PET .z: O io ITO G L A SS Ö -H O NOTES: 1. 2. 3. 4.

420495

Abstract: AN2738 DOT MATRIX PRINTER SERVICE MANUAL AN2666 AN2736 AN2739 MPC7447 MPC7450 Discovery II
Contextual Info: Freescale Semiconductor Application Note AN2743 Rev. 0.1, 08/2004 Software Analysis on Genesi Pegasos II Using PMON and AltiVec by Maurie Ommerman and Sergei Larin CPD Applications Freescale Semiconductor, Inc. Austin, TX This application note is the sixth in a series describing the Genesi

1932031-1

Abstract: 64x42
Contextual Info: 107-68043 Packaging Specification 04Feb09 Rev AE SOCKET ASSEMBLY, DIMM 2P 1. PURPOSE 目的 Define the packaging specification and packaging method of SOCKET ASSEMBLY, DIMM 2P products. 订定SOCKET ASSEMBLY, DIMM 2P 产品之包装规格及包装方式。

galia carton

Contextual Info: Spécification de conditionnement EMBASES 5 VOIES MULTILOCK SORTIE COUDEE 90° A FIXATION RAPIDE ET A SOUDER SUR CARTE IMPRIMEE 20 NOV 03 Rév. B 107-15419 1. BUT Cette spécification définit les matériels et les méthodes de conditionnement des embases 5 voies Multilock

mcr 5152

Abstract: UM82C450 csc 5151 rts 5136 um82c650 csc 5151 a T-15 UM82C550 UM82C550l
Contextual Info: UNICORN MI CR OEL ECTR ONIC S 5 ME D • TE7ô7ôa OOGQbS? T ■ % I jy / lr 5 ^ - _ r - ' 7 5 " - 3 ,? - 0 £ “ UM 82C550 Asynchronous Communications Element with FIFOs p r e l im in a r y Features: ■ Capable of running all existing UM82C450 software