94502 Search Results

IRF2204L

Abstract: IRF2204S
Contextual Info: PD - 94502 IRF2204S IRF2204L AUTOMOTIVE MOSFET Typical Applications ● ● HEXFET Power MOSFET Electric Power Steering 14 Volts Automotive Electrical Systems D VDSS = 40V Features ● ● ● ● ● ● Advanced Process Technology Ultra Low On-Resistance

IRF 450 MOSFET

Abstract: IRF2204L IRF2204S 170AV 94502
Contextual Info: PD - 94502 IRF2204S IRF2204L AUTOMOTIVE MOSFET Typical Applications ● ● HEXFET Power MOSFET Electric Power Steering 14 Volts Automotive Electrical Systems D VDSS = 40V Features ● ● ● ● ● ● Advanced Process Technology Ultra Low On-Resistance

Contextual Info: PD - 94502 IRF2204S IRF2204L AUTOMOTIVE MOSFET Typical Applications ● ● HEXFET Power MOSFET Electric Power Steering 14 Volts Automotive Electrical Systems D VDSS = 40V Features ● ● ● ● ● ● Advanced Process Technology Ultra Low On-Resistance

Contextual Info: RN PAK-8/PAK-51M P08 — 050 H Detail A S = 4 :1 X TiE?Ü D b Plating I ,D = Type D L = Locator Posts —1 No. of Contacts 50 X — D — TG Number of Contacts: — J 50 H = Hermaphroditic — C = Adhesive Suction Cover Blank = No Adhesive Cover A B C D

Contextual Info: RN PAK-8/PAK-5 U-V Cross Section S = 4 : 1 -T-. o +! in CO - nnnnnUnoAn in o> ►- 1—m LO CD CO UUI/UUU TiESDOfc. r NX L, 0. 3 5 0. 8 2. 7 2 ± . 1 0. 1 TEQ 9ihDDD0 B ± 0. 1 5 Mated Mating area | N 0.45 Mating area m Mated with P08-XXXSLXX-A-G

Contextual Info: M DESCRIPTION “A” PCB THICKNESS POSITIONS/ GRIDS COMMENTS MP2-SP08-41R1 -XXXX MP2-SP08-41R2-XXXX 2.72 3.53 1.60 2.40 4X2 4X2 All positions filled. Non heat stake holdown All positions filled. Non heat stake holdown E T P A K 2 MP2 — SP 08 — 4 iA Q

Contextual Info: DESCRIPTION DIM “A” MP2-HP08-41S1-XXXX 4.30 re tOO y . MATING LENGTH ROW B ROW C 6.50 6.50 ROWD 6.50 m iiii EbE ¿hiïDDDD '[¿EiïDQb ft« ROW A 6.50 Plating: TR = .254 nm 10 (¿inch ROBEX min on Area 1 2.54 urn (100 jtinch) min. Tin/Lead on Area 2.

Contextual Info: METPAK 21X1 D ESCRIPTIO N "A” MP2-HS024-4X 11.95mm MP2-HS048-4X 23.95mm MP2-HS072-4X 35.95mm MP2-HS096-4X 47.95mm MP2-HS120-4X 59.95mm MP2-HS144-4X 71.95mm MP2-HS168-4X 83.95mm MP2-HS192-4X 95.95mm REAR PLUG UP MATE LENGTHS METPAK 2 SHROUD MP2-HSXXX-41 M ETPAK 2 HEADER

Contextual Info: METPAK 2 MP2 — SP 10 — 5 METPAK 2 Series I 1 SX — xxxx - Plating: TR, TR30 • ¡P S Socket, Power Type Solder Tail Length 1 = 2.72mm 0.107 in. 2 = 3.53mm (0.139 in.) Number of Positions — 10(5x2) 5 Row Grid- L S = Solder Tail Termination

Contextual Info: RN PAK-8/PAK-5IM P05 — XXX — A — G "TZ Z T Number of Contacts: 20, 30, 40, 50, 60, 80, 100 P = Plug- Plating A = Type A Packaging: T = Tape & Reel EET OhtiODDO '[¿EiïOOfc. Assembly Drawing Section X-Y Ln hu under Over 60 80 c o n t a c t s : 0. 10

Contextual Info: GB150TS60NPbF www.vishay.com Vishay Semiconductors INT-A-PAK "Half-Bridge" Ultrafast Speed IGBT , 138 A FEATURES • Generation 5 Non Punch Through (NPT) technology • Ultrafast: Optimized for hard switching speed 8 kHz to 60 kHz • Low VCE(on) • 10 s short circuit capability

complementary JFET

Abstract: LH0063 Hypertronics LH0063CK YSK0102004 BB3553AM Robinson Hudson Robinson Nugent BB3553 LH0063C
Contextual Info: ykiyjxiyki 19-0388; Rev 2; 2/93 Very F a s t B u ffe r A m p lifie rs _ A p p lic a tio n s High Speed Line Drivers Video D rivers/Im pedance Transform ation N uclear Instrum entation A m p lifie rs O perational A m p lifie r Isolation

p112 opto

Abstract: TR30 MCH068TAN01ATR30 MCH068TAN02CTR30 MCH068TAN03ATR30
Contextual Info: HEADER: Power Pins, .197” 5.0mm long: 1,17, 34, 35, 51,68 Signal Pins, 167" (4.24mm) long: 2-16, 18-33, 37-50, 52-66 Detect Pins, .137" (3.48mm) long: 36,67 m MCH 068 T A N 01 A TR30 H 0 4 . MEMORY CARO HEAOER— O O O O O O O O O O O O O O O M M ER OF CONTACTS-

Robinson Nugent

Abstract: MARKING P10 p10 plug BC10
Contextual Info: B o -H o o A CsJ 3 00 CO A . 10±0. o . K h -H -H -ll-lu ll n r J = ' E aH=o m 0. 80+ 0. 0 5 o . c ± 0. 1 R e c o mm e n d e d P C b o a r d mounting pad layout pattern 2 Pip — XXX S L — G a T Number of Contacts:-10, 16, 20, 30 S = Socket_ Plating

Contextual Info: /M /J X I/M Very Fast Buffer Am plifiers _Applications High Speed Line Drivers Video D rivers/Im pedance Transform ation Nuclear Instrum entation A m plifiers O perational A m p lifie r Isolation High Speed A to D Input Buffers Video Cross Point Switches

Contextual Info: J V W r A A J V X P o w e r O p e ra tio n a l A m p lifie r _F e a tu re s The M axim LH0101 Power O perational A m p lifie r de­ livers up to 5 A m p peak o u tp u t current. Packaged in a rugged TO -3 case, the LH0101 com b in e s the ease of

Contextual Info: 9450SL Series Thin-Trim Trimmer Capacitors The Thin-Trim® 9450 series capacitor is an advanced development in miniaturized trimmers for applications in circuits where size and performance are critical. These one-half turn ceramic capacitors feature high Q

P08-XXXSLXX

Contextual Info: c±o. 1 u n d e r 4 0 c o n t a c t s : 0 . 10 Ov e r 50 c o n t a c t s : 0 . 15 M a te d Mated with P08-XXXSLXX-A-G Socket Mated with P08-XXXSLXX-B-TG Socket Mated with P08-XXXSLXX-A-G Socket Mated with P08-XXXSLXX-B-TG Socket 3 P 5. 2 . 0. 8 0 I I a " 1

Contextual Info: DIMMPAK Mugent -VRAM DIMM Socket * Effectively provides double density packaging * Superior shock and vibration performance * User friendly ejector system for easy module removal High temp material compatible with IR processes

Robinson Nugent socket

Abstract: Robinson Nugent socket connector
Contextual Info: P08 — XXX H LX Mat ed T Plating - E = Type E C = Adhesive Suction Cover Blank = No Adhesive Cover H = Hermaphroditic — E.o. E — TG T Number of Contacts: u 30, 40, 50, 80, 100 L = Locator Posts - I 0. Printed Circuit Board Layout S* o 0 . 3 5 .» 00. 9*;

Robinson

Abstract: E14-16
Contextual Info: METPAK 2 DESCRIPTIO N REAR PLUG UP MATE LENGTHS “A” METPAK 2 SHROUD MP2-HS030-5X 11.95mm MP2-HS060-5X 23.95mm MP2-HS090-5X 35.95mm MP2-HS120-5X 47.95mm MP2-HS150-5X 59.95mm MP2-HS180-5X 71.95mm MP2-HS210-5X 83.95mm MP2-HS240-5X 95.95mm M ETPA K 2 HEADER

DSP56001 users manual

Abstract: f32 motorola DSP56000 DSP56001 SCF 112 S1535 B1401 Nippon capacitors
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP56001/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of MotorolaÕs family of

3553AM

Abstract: h0063ck
Contextual Info: ykiyjxiyki 19-0388; Rev 2; 2/93 Very F a s t B u ffe r A m p lifie rs Features ♦ Pin for Pin 2nd Source ♦ ♦ ±10V Output Drive Into 5 0 il ♦ 2ns Rise and Fall Times ♦ Wide Range Single or Dual Supply Operation ♦ _ A pplications

tgn 600

Contextual Info: RN 1C PAK N uaent Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Plating: TT = 2.03 pm (80 flinch) Tin/Lead overall. Phosphor Bronze 1.27 pm (50 pinch) Nickel underplate. SOCKETS ELECTRICAL Current Rating: 0.5 Ampere per contact