8965 Search Results

Contextual Info: Package/Price Information Dual 12-Bit CMOS DAC with Parallel Load Input Structure Model Status Package Description Pin Count Temperature Range Price* 100-499 5962-89657023A PRODUCTION CER. LEADLESS CHIP CARRIER 28 MILITARY $145.12 5962-8965702LX PRODUCTION

A260

Abstract: DC jack SMD
Contextual Info: 8965 S e rie s □upiin Earphone Jack 0 2.5mm SMD Type Material: Housing: High Temperature Plastic UL94V-0. Contacts: Phosphor Bronze. Electrical Characteristics: Contact Resistance: 30mQ max. Insulation Resistance: 50MQ min. Rating: DC 12V, 1 A. Dielectric Withstanding Voltage: 250V AC RMS applied

DC jack SMD

Abstract: A259
Contextual Info: 8965 S e rie s □upiin Earphone Jack 0 2.5mm SMD Type Material: Housing: High Temperature Plastic UL94V-0. Contacts: Phosphor Bronze. Electrical Characteristics: Contact Resistance: 30mQ max. Insulation Resistance: 50MQ min. Rating: DC 12V, 1 A. Dielectric Withstanding Voltage: 250V AC RMS applied

A197

Abstract: smd hf
Contextual Info: 8965 S eries □upun E arphone Jack 0 2 .5 m m SMD Type Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze, Silver Plated. E lectrica l C h aracteristics: Contact Resistance: 30mf5 max. Insulation Resistance: 50MQ min. at 250V DC.

A196

Contextual Info: 8965 S eries E a r p h o n e J a ck 0 2 .5 m m □upiin SMD Type Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze, Gold Plated. E lectrica l C h aracteristics: Contact Resistance: 30mG max.

A249

Abstract: earphone smd
Contextual Info: 8965 Series □ m in Earphone Jack 0 2.5mm SMD Type Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze. Electrical Characteristics: Contact Resistance: 30mQ max. Insulation Resistance: 50MQ min. at 250V DC.

A195

Contextual Info: □upnn 8965 Series Earphone J a c k 0 2.5mm SMD Type Material: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze, Silver Plated. Housing: Electrical Characteristics: 30m Q max. 50M Q min. at 250V DC. DC 12V, 0.3A max.

A258

Contextual Info: 8965 Series □upiin Earphone J a c k 0 2.5mm SMD Type M aterial: Housing: High Temperature Plastic UL94V-0. Contacts: Phosphor Bronze. E lectrical C haracteristics: Contact Resistance: 30mQ max. Insulation Resistance: 50MQ min. Rating: D C 12V, 1 A. Dielectric Withstanding Voltage: 250V AC RMS applied

Contextual Info: Definite Purpose Control Catalog 8910CT9301R12/13 2014 Class 8910, 8911, 8965, 9998, 9999 CONTENTS Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page Contactors, Class 8910 Types DP and DPA . . . . . . . . . . . . . . . . . . . . . . . .3

A246

Contextual Info: 8965 Series □ m in E a rp h o n e J a c k 0 2.5m m S M D T y p e M aterial: Housing: High temperature housing U L94V -0 withstands IR and V P R soldering methods. Contacts: Phosphor Bronze. E lectrical C haracteristics: Contact Resistance: 30m Q max. Insulation Resistance: 50M Q min. at 250V D C .

A248

Abstract: A2-48
Contextual Info: 8965 Series □ m in Earphone Jack 0 2.5mm SMD Type Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze. E lectrical C h aracteristics: Contact Resistance: 30mQ max. Insulation Resistance: 50MQ min. at 250V DC.

A257

Contextual Info: 8965 Series □upiin E a rp h o n e J a c k 0 2.5m m S M D T y p e Material: Housing: High Temperature Plastic UL94V-0. Contacts: Phosphor Bronze. Electrical Characteristics: Contact Resistance: 30mQ max. Insulation Resistance: 50MQ min. Rating: DC 12V, 1 A.

D8965

Contextual Info: Z~Communications, Inc. Z - C O nr i U NI C A TI O NS INC 45E D 9939 Via Pasar • San Diego, California 92126 Phone 619 621-2700 FAX (619)621-2722 TTbbMbb GDQOBSb M miCI VCO MODEL D-8965 " T - Ç O - t S PAGE1 PHASE NOISE (1Hz BW) (TYP) FEATURES Exceptional Phase Noise Characteristics

Contextual Info: NOTE 1 NOTE 2 L. PDTTIEGER 4 / 16/91 T. LEMKE 4 / 16/91 T. LEMKE T. LEMKE 4 / 16/91 4 / 16/91 MICRDPAX 0S5M, STR PLUG ASS' Y DOUBLE MDDULE 89653

LR2-D35

Abstract: LR2-D15 LR2D33 LR2-D13 LR2D15 LR2D3357 8910 dpa 24 definite purpose contactor 8910 DPA 34 lr2d13 LR2-D1308
Contextual Info: Definite Purpose Control Class 8910, 8911, 8965, 9998, 9999 CONTENTS Description Page Types DP, DPA and SYD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7

VT8235CE

Abstract: 8089c via vt1634al medion Mitac 8089C Motherboard Schematic samsung crt monitor 56v circuit diagram CGR18650C VT1632 via vt8235 chipset south bridge PN880
Contextual Info: SERVICE MANUAL FOR 8965 BY: Sinty Zhang Repair Technology Research Department /EDVD Apr.2005 / R01 8965 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

A247

Contextual Info: 8965 Series □upiin Earphone J a c k 0 2.5mm SMD Type Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze. Electrical Characteristics: Contact Resistance: 30m Q max. Insulation Resistance: 50M Q min. at 250V DC.

A194

Abstract: earphone jack
Contextual Info: □upiin 8965 Series E a rp h o n e J a ck 0 2 .5 m m SMD Type Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Phosphor Bronze, Silver Plated. E lectrical C haracteristics: Contact Resistance: 30mQmax.

Contextual Info: KEY ORIENTATION RIGHT SEE DETAIL F LEFT 89654-001 12 12 89654-002 6 6

SJ105968

Contextual Info: 89650 IPS c -o n QNiMVüa -is-#ma 1 3 / 8 - 1 8 U N E F -2B SECT. A-A D O F - 0 — 2 1 2 F 0 5 . 08? ( S C A L E NOTE A 10 20 BO 40 50 60 1 ) 1 . A L T E R N A T E I N S E R T P O S I T I O N S ARE MA R K E D I N T HE A R E A SHOWN. COMP A NY LOGO AND P A R T NUMBER A P P E A R S I N T HE

NAN25-7610

Abstract: EN61000-4-2 EN61000-4-4 EN61000-4-5 IEC801-3 VDE0871
Contextual Info: NAN25 SERIES SPECIFICATIONS RS Stock Numbers: 231-8937 231-8965 231-8959 231-8987 231-8921 231-8971 All specifications are typical at nominal input, nominal output voltage, max. load and 25oC unless otherwise stated. ELECTROMAGNETIC COMPATIBILITY SPECIFICATIONS

sk233

Abstract: I50U
Contextual Info: 8 PRODUCT NO 89655-001 CUSTOMER COPY COOE IOENT 22526 MA TL WAS SK-23360 .O O t.O l/.O t.J thibo TABULATION ’'ES SrCETS REQUIRED NO »gi «wxccTiot ,0 0 0 t.005/.00«.13 .00001.0020/.000«.051 ANGLES 0 * « 2* NOTE l L.POTTEIGEP MICROPAX 050M, 80 POS FLEX CABLE PLUG

circuit diagram for split air conditioner

Abstract: AD597 AD597A circuit op07 for thermocouple type k control thermocouple AD597H circuit diagram of split air conditioner OVEN* temperature sensor AD594 AD596
Contextual Info: a FEATURES Low Cost Operates with Type J AD596 or Type K (AD597) Thermocouples Built-In Ice Point Compensation Temperature Proportional Operation – 10 mV/؇C Temperature Setpoint Operation – ON/OFF Programmable Switching Hysteresis High Impedance Differential Input

BLVDS-25

Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
Contextual Info: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)