89189 Search Results

MIL-STD-202 METHOD 301

Abstract: MIL-STD-1344, Method 3001
Contextual Info: _! CONTECH RESEARCH, INC, -~ -iiv - - - - - MAY 16, 1389 TEST REPORT 89189 VERIFICATION TESTISG PART NUMBER: SS-120-T-2N SPECIFICATION: AJCO88 SAMTEC CORPORATICN 67 MECHANIC STREET AITLEBORO, MASSACHUSEllS 02703 SO8/ 226-4800 MAY 16, 1989 TEST REPORT #89189

bh 26 00

Abstract: DH80102 BH-2003 BH301 80204 89129 R/BH-202
Contextual Info: SILICON PIN AND NIP DIODES FOR SWITCHING AND PHASE SHIFTING APPLICATIONS MEDIUM AND HIGH POWER This series of high power, high voltage PIN and NIP diodes incorporates ceramic-glass passivated mesa technology. A broad range of products is available, In terms of breakdown voltages, junction

fad27

Abstract: FAD47 FRQ01 FAD21 FAD30 FAD45 FAD26 fca 173 FAD 203 FAD37
Contextual Info: NEUBRIDGE MICROSYSTEMS NEWBRIDGE fc.4E D • b5öölQl JANUARY, 1993 MICROSYSTEMS Fully compatible with IEEE Std 896.1 - 1991 - Profiles A & B register selectable TTL input/output levels Low power CMOS implementation Futurebus+ interface - 896.1 compelled mode data transfer protocol

230NT

Contextual Info: F-207 m samTëc F T S H -1 1 0 -0 1 -L -D V F T S H -1 2 0 -0 2 -F -D V SHT .050“ MICRO HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?FTSH SERIIES ALSO AVAILABLE M a te s w ith: FFSD, CLP, FLE, SFMC, SFMH

samtec ASP 146

Contextual Info: F-207 m samTëc T M M -1 0 8 -0 3 -T -Q T M M -1 1 6 -0 1 -G -S T M M -1 0 6 -0 4 -S -D T M M -1 1 2 -0 1 -L -D -R A m ro u g n \ W 2mm LOW PROFILE SPECIFICATIONS For complete specifications see www.samtec.com?TMM In sulator Material: TMM SERIES 'Ultra-low profile

Contextual Info: I >8 mm SPECIFICATIONS For com plete specifications and recom m ended PCB layouts see www.sam tec.com ?QSE Insulator Material: Liquid C rystal •ill Polym er mm mis* Term inal Material: P hosphor Bronze ii<£ * Plating: Au over 50p" 1 ,27pm) Ni C urrent Rating:

40x8

Contextual Info: F-207 m samTëc OPEN PIN FIELD INTERCONNECTS OPEN PIN FIELD ARRAY SPECIFICATIONS For com plete specifications and recom m ended PCB layouts see www .sam tec.com ?SEAF In sulator Material: Black LCP C ontact Material: C opper Alloy C urrent Rating: 2.7 A Operating Tem p Range:

Contextual Info: F-206-1 Te c M TM M -114-05-T-Q -225 M TM M -108-07-G -D -200 JSV MODIFIED HEADER M TM M -124-14-S-S-600 m rougn x SPECIFICATIONS For complete specifications see www.samtec.com?MTMM MTMM SERIES Choice of single, double or quad row M ates with: CLT, SQT, SQW, ESQT,

Contextual Info: F-207 s am samTec 75Q S S P E C IF IC A T IO N S For complete specifications and recommended Cable Stripping see www.samtec.com?SMB7H B& SMB7H □ OX SMB7H, MCX7 SERIES PLATING GENDER Shell Material: Brass Contact Material: Brass Insulator Material: Teflon

Contextual Info: SC Mates w ith: APf APS, APO, APA, APE.APH Highest re lia b ility DIP sockets 1C and ICS series DIP sockets feature U.L. rated G.F. polyester body with mounting holes and use precision machined lead sockets for high reliability in the most demanding applications.

Contextual Info: F-206-1 ,8mm HI-SPEED DATA LINK HFEM2 SERIES SPECIFICATIONS For complete specifications see www.samtec.com?HFEM-DP www.samtec.com?HFEM2-DP or www.samtec.com?HFEM2-SE -D P M a t e s w ith : QTE-DP, Q S E -D P -S E M a t e s w ith : Differential Pairs or \ SingleEnded

Contextual Info: 1G 1rA i G LElD-S11B SPECIFICATIONS D S M -3 1 8 , D S M -5 9 0 S E R IE S Insulator Material: Black High Temperature Thermoplastic Pin Material: Brass Socket Material: Phosphor Bronze Shell Material: Steel Plating: Gold on Contacts, Nickel on Shell, Tin-Lead on Tails

Contextual Info: F-207 M TM M -114-05-T-Q -225 M TM M -108-07-G -D -200 JSV MODIFIED HEADER M TM M -124-14-S-S-600 in r o u g n x SPECIFICATIONS For complete specifications see www.samtec.com?MTMM MTMM SERIES M ates with: CLT, SQT, SQW, ESQT, TLE, SMM, MMS, TCSD Insulator Material:

Contextual Info: F-206-1 Te c , 80mm HI-SPEED C O A T I T C U v IV C T I HSEC8 SERIES SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com? HSEC8 Insulator Material Black Liquid Crystal Polymer Contact: BeCu Platina: Au or Sn over 50p" 1,27pm Ni

samtec tsm

Abstract: 1-800-SAMTEC-9 TSM-110-01-T-DV tsm11001tdv
Contextual Info: F-205-1 amte c Mates with: SSW, SSQ, SSM, BSW, ESW, ESQ, BCS, SLW, CES, IDSS, IDSD, HLE LEAD STYLE 111I PN0E R PINS ro w XQM I o iv i H y SPECIFICATIONS I 02 thru 36 For com plete specifications see w w w .sam tec.com ?TSM Insulator Material: B lack Liquid C rystal

1-800-SAMTEC-9

Abstract: J302
Contextual Info: F-205-1 a m te c 2mm LOW PROFILE Tiger Claw contacts Mates with: TMM, TMMH, MTMM, MMT, TW SPECIFICATIONS For complete specifications see www.samtec.com?CLT Insulator Material: Black Liquid Crystal t o Polymer Contact Material: Phosphor Bronze Plating: Sn or Au over

Contextual Info: V40100G, VI40100G www.vishay.com Vishay General Semiconductor Dual High-Voltage Trench MOS Barrier Schottky Rectifier Ultra Low VF = 0.42 V at IF = 5 A FEATURES TMBS • Trench MOS Schottky technology TO-262AA TO-220AB • Low forward voltage drop, low power losses

icf-648

Contextual Info: F -2 07 S U P P L E M E N T sam tëc ICF-648-S-I P L C C -0 4 4 -F -A SURFACE MOUNT SOCKETS SPEC IFIC A TIO N S For com plete specifications and recom m ended P C B layouts se e w w w .sam tec.com vlCF Insulator Material: B la ck L C P Contact Material: BeCu

1-800-SAMTEC-9

Contextual Info: PES PES 08 RA 04 SD VT 02 POWER EDGE ' SOCKET PES SERIES SPECIFICATIONS For com plete specifications see w w w .sam tec.com ?PES In sulator M aterial: Black LCP Term inal M aterial: C opper Alloy Plating: Sn or Au over 50p" 1,27|jm Ni C urrent Rating: 2 5A @ 80°C

PC104

Contextual Info: F-207 SUPPLEMENT a m te c 2mm HI-DENSITY SOCKET SERIES SPECIFICATIONS M a te s w ith : YTT, YTW, YTE For complete specifications see www.samtec.com?YTE Insu lator Material: Black Liquid Crystal t o Polymer "“ «•« Contact Material: Phosphor Bronze C urrent Rating:

Futurebus

Contextual Info: m m m r s e p te m b e r1 " 1 c a 9 ic 8 9 6 FUTUREBUS+ ARBITER • Fully compatible with IEEE P896.1 -1991 • IEEE 1149.1 JTAG testability port • TTL input/output levels • Low power CMOS implementation • Futurebus* Interface - 254level priortty/round-robin arbiter

FAD41

Abstract: FAD33 FAD17 LAD-23 FAD20 fad27 FAD34 FAD47 ts4 1060 FAD32
Contextual Info: NEWBRIDGE MICROSYSTEMS NEWBRIDGE b4E D • tj5ññlDl 0 D 0 2 0 1 1 JANUARY, 1993 MICROSYSTEMS Fully compatible with IEEE Std 896.1 -1991 - Profiles A & B register selectable TTL input/output levels Low power CMOS implementation Futurebus+ interface - 896.1 compelled mode data transfer protocol

Contextual Info: F-207 m samTëc POWER/Q2 SIGNAL COMBO SPECIFICATIONS 1 OMS W Vj C I V I O For complete specifications and recommended PCB layouts see www.samtec.com?QMS-PC or www.samtec.com?QFS-PC si Insulator Material: Liquid Crystal Polymer Contact,Terminal & Ground Plane Material:

Contextual Info: F-207 m samTëc F T S H -1 2 0 -0 2 -F -D F T S H -1 3 0 -0 2 -L -D -E S T,H .050" MICRO HEADER SER IES SPECIFICATIONS Impedance matchedA for high speed applications Mated with CLP series M a te s w ith: FFSD, CLP, FLE, SFMC For complete specifications see www.samtec.com?FTSH