881E18C Search Results
881E18C Price and Stock
GSI Technology GS881E18CGD-333ISRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 4.5ns/2.5ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-333I) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CGD-333I | Tray | 24 Weeks | 144 |
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GSI Technology GS881E18CGT-200ISRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 6.5ns/3ns 100-Pin TQFP Tray - Trays (Alt: GS881E18CGT-200I) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CGT-200I | Tray | 72 |
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GSI Technology GS881E18CGD-200ISRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-200I) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CGD-200I | Tray | 144 |
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Buy Now | ||||||
GSI Technology GS881E18CGD-200IVSRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-200IV) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CGD-200IV | Tray | 24 Weeks | 144 |
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Buy Now | |||||
GSI Technology GS881E18CD-200SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CD-200) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CD-200 | Tray | 144 |
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Buy Now | ||||||
881E18C Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
gs881e18c/gs881e32c/gs881e36c100-pin+3 | |
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Contextual Info: Preliminary 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
gs881e18c/gs881e32c/gs881e36c100-pin+3 | |
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Contextual Info: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation |
Original |
gs881e18/32/36c100-pin165-bumpsupply881e18c+2 | |
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Contextual Info: GS881E18/32/36C T/D -xxxI 100-Pin TQFP & 165-bump BGA Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
gs881e18/32/36c100-pin165-bumpsupply881e18c+2 | |
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Contextual Info: 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
gs881e18c/gs881e32c/gs881e36c100-pin+3 | |
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Contextual Info: 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
gs881e18c/gs881e32c/gs881e36c100-pin+3 |