881E18C Search Results
881E18C Price and Stock
GSI Technology GS881E18CGT-250IVSRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 5.5ns/3ns 100-Pin TQFP Tray - Trays (Alt: GS881E18CGT-250IV) |
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GS881E18CGT-250IV | Tray | 24 Weeks | 72 |
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GSI Technology GS881E18CD-150VSRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 7.5ns/3.8ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CD-150V) |
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GS881E18CD-150V | Tray | 24 Weeks | 144 |
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GSI Technology GS881E18CGD-250SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 5.5ns/2.5ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-250) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CGD-250 | Tray | 144 |
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GSI Technology GS881E18CD-150SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 7.5ns/3.8ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CD-150) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CD-150 | Tray | 144 |
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GS881E18CD-150 |
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GSI Technology GS881E18CD-250ISRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 5.5ns/2.5ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CD-250I) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GS881E18CD-250I | Tray | 144 |
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881E18C Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 100-lead | |
Contextual Info: Preliminary 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 100-lead | |
Contextual Info: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation |
Original |
GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C | |
Contextual Info: GS881E18/32/36C T/D -xxxI 100-Pin TQFP & 165-bump BGA Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation |
Original |
GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C | |
Contextual Info: 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 881E18C | |
Contextual Info: 881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline |
Original |
GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 881E18C |