876 FUJITSU Search Results

100mil

Abstract: 17-pin 876 pin ZIP017-P-0323-1
Contextual Info: ZIG-ZAG IN-LINE PACKAGE 17 PIN PLASTIC ZIP-17P-M01 EIAJ code : ∗ZIP017-P-0323-1 17-pin plastic ZIP Lead pitch 50mil Row spacing 100mil Sealing method Plastic mold ZIP-17P-M01 17-pin plastic ZIP (ZIP-17P-M01) +0.20 +.008 22.25 –0.30 .876 –.012 2.85±0.25(.112±.010)

SIP-9P-M01

Abstract: S09002S-3C-3 876 pin
Contextual Info: SINGLE IN-LINE PACKAGE 9 PIN PLASTIC SIP-9P-M01 EIAJ code : ∗SIP009-P-0000-1 9-pin plastic SIP Lead pitch 100mil Sealing method Plastic mold SIP-9P-M01 9-pin plastic SIP (SIP-9P-M01) 2.85±0.25 (.112±.010) +0.20 22.25 –0.30 .876 +.008 –.012 1 PIN INDEX

SIP-9P-M01

Abstract: 876 fujitsu SIP009-P-0000
Contextual Info: SINGLE IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 9 PIN PLASTIC To Top / Package Lineup / Package Index SIP-9P-M01 EIAJ code :∗SIP009-P-0000-1 9-pin plastic SIP Lead pitch 100 mil Sealing method Plastic mold SIP-9P-M01 9-pin plastic SIP (SIP-9P-M01)

876 fujitsu

Abstract: ZIP017-P-0323-1 17-pin
Contextual Info: ZIG-ZAG IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 17 PIN PLASTIC To Top / Package Lineup / Package Index ZIP-17P-M01 EIAJ code :∗ZIP017-P-0323-1 17-pin plastic ZIP Lead pitch 50 mil Row spacing 100 mil Sealing method Plastic mold ZIP-17P-M01 17-pin plastic ZIP

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P38 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P38) 168-pin plastic DIMM (socket type)

9808

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P27 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P27) 168-pin plastic DIMM (socket type)

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P26 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P26) 168-pin plastic DIMM (socket type)

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P36 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P36) 168-pin plastic DIMM (socket type)

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P39 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P39) 168-pin plastic DIMM (socket type)

MDS-168P-P24

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P24 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P24) 168-pin plastic DIMM (socket type)

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P37 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P37) 168-pin plastic DIMM (socket type)

MDS-168P-P40

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P40 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P40) 168-pin plastic DIMM (socket type)

Nec K 872

Abstract: 2SD887 2sc1162 2SD883 2sc2335 2SD877 2SD756 2sd756 e 2sc3114 2SC3247
Contextual Info: - s € tt « Manuf. T y p e No. H Ä SANYO S T O SHIBA S m NEC ÍI HITACHI S ± iS FUJITSU fâ T MATSUS H I T A 2 S D 860 ✓' ta T 2SC25S2 2SD 860A te T 2SC2552 2SD 860B fâ T 2SC2552 2SD 861 «- te T 2SC2552 2SC3169 2SD 861A te T 2SC2552 2SC3169 2SD 861B

Contextual Info: DUAL IN-LINE TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 168 PIN PLASTIC MDS-168P-P41 168-pin plastic DIMM socket type Lead pitch 1.27 mm Motherboard material Plastic Mounted package material Plastic Pin plating Gold (MDS-168P-P41) 168-pin plastic DIMM (socket type)

Contextual Info: FLK022WG FUJITSU X-Ku Band Power GaAs FETs FEATURES • • • • • High Output Power: P-|<jB = 24.0dBm Typ. High Gain: G ^ b = 7.0dB(Typ.) High PAE: r iadd = 32%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLK022WG is a power GaAs FET that is designed for general

PT 1440

Contextual Info: F L X 102 M H - ¡2 X -k ii B a n d Power iaAs FETs ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C Item Symbol uonamon Rating Unit Drain-Source Voltage Vd S 15 V Gate-Source Voltage vgs ~5 V 7.5 w °c °c Total Power Dissipation Pt Tc = 25°C Storage Temperature

FLX102MH-12

Abstract: cu2cu FUJITSU XBAND FLX102MH12
Contextual Info: n FLX102MH-12 X-Ku Band Power GaAs FETs . I 1jU FEATURES • • • • • High Output Power: P-|dB = 30.0dBm Typ. High Gain: G ^ b = 7.5dB(Typ.) High PAE: r iadd = 33%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLX102MH-12 is a power GaAs FET that is designed for general

Contextual Info: i *E. ûb «w i « 3» FUJITSU SEMICONDUCTOR DATA SHEET LINEAR 1C DUAL OPERATIONAL AMPLIFIER MB47358 DUAL OPERATIONAL AMPLIFIER OPERATES A SINGLE OR DUAL POWER SUPPLY The Fujitsu MB47358 is designed for a general purpose dual operational amplifier with internal frequency

Contextual Info: F|.fjU,. FLX102MH-12 X-Ku Band Power GaAs FETs r U J I I ->U FEATURES • • • • • High O utput Power: P-|<jB = 30.0dBm Typ. High Gain: G ^ b = 7.5dB(Typ.) High PAE: r iadd = 33% (Typ.) Proven Reliability Herm etic M etal/C eram ic Package DESCRIPTION

Contextual Info: FLL300IP-4 FEATURES • • • • Push-Pull Configuration High PAE: 40% Typ. Broad Frequency Range: 3400 to 3600 MHz. Suitable for class A operation. DESCRIPTION The FLL300IP-4 is a 30 Watt GaAs FET that employs a push-pull design which offers ease of matching, greater consistency and a broader bandwidth for high

FLL300IP-4

Contextual Info: FLL300IP-4 FEATURES • • • • Push-Pull Configuration High PAE: 40% Typ. Broad Frequency Range: 3400 to 3600 MHz. Suitable for class A operation. DESCRIPTION The FLL300IP-4 is a 30 Watt GaAs FET that employs a push-pull design which offers ease of matching, greater consistency and a broader bandwidth for high

Contextual Info: FLL300IP-4 FEATURES • • • • Push-Pull Configuration High PAE: 40% Typ. Broad Frequency Range: 3400 to 3600 MHz. Suitable for class A operation. DESCRIPTION The FLL300IP-4 is a 30 Watt GaAs FET that employs a push-pull design which offers ease of matching, greater consistency and a broader bandwidth for high

FLL300IP-4

Abstract: 15 GHz power amplifier Output Power 37dBm Fujitsu GaAs FET Amplifier fujitsu gaas fet L-band
Contextual Info: FLL300IP-4 FEATURES • • • • Push-Pull Configuration High PAE: 40% Typ. Broad Frequency Range: 3400 to 3600 MHz. Suitable for class A operation. DESCRIPTION The FLL300IP-4 is a 30 Watt GaAs FET that employs a push-pull design which offers ease of matching, greater consistency and a broader bandwidth for high

FLL300IP-4

Abstract: FLL30
Contextual Info: FLL300IP-4 FEATURES • • • • Push-Pull Configuration High PAE: 40% Typ. Broad Frequency Range: 3400 to 3600 MHz. Suitable for class A operation. DESCRIPTION The FLL300IP-4 is a 30 Watt GaAs FET that employs a push-pull design which offers ease of matching, greater consistency and a broader bandwidth for high