84 FBGA OUTLINE Search Results

E5116

Abstract: DDR2-400 DDR2-533 DDR2-667 EDE5116AFSE EDE5116AFSE-4A-E EDE5116AFSE-5C-E EDE5116AFSE-6E-E
Contextual Info: DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Specifications Features • Density: 512M bits • Organization  8M words × 16 bits × 4 banks • Package: 84-ball FBGA  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

DDR2-667

Abstract: EDE5116AJBG
Contextual Info: PRELIMINARY DATA SHEET 512M bits DDR2 SDRAM WTR Wide Temperature Range EDE5116AJBG-LI (32M words x 16 bits) Specifications Features • Density: 512M bits • Organization  8M words × 16 bits × 4 banks • Package  84-ball FBGA  Lead-free (RoHS compliant)

Contextual Info: DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Specifications Features • Density: 512M bits • Organization  8M words × 16 bits × 4 banks • Package: 84-ball FBGA (µBGA)  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

Contextual Info: DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Specifications Features • Density: 512M bits • Organization  8M words × 16 bits × 4 banks • Package: 84-ball FBGA (µBGA)  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

Contextual Info: PRELIMINARY DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Description Features The EDE5116AFSE is a 512M bits DDR2 SDRAM organized as 8,388,608 words × 16 bits × 4 banks. It is packaged in 84-ball FBGA (µBGA) package. • Power supply: VDD, VDDQ = 1.8V ± 0.1V

DDR2-533

Abstract: DDR2-667 EDE5116AFSE EDE5116AFSE-4A-E EDE5116AFSE-5C-E EDE5116AFSE-6E-E DDR2-400
Contextual Info: DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Description Features The EDE5116AFSE is a 512M bits DDR2 SDRAM organized as 8,388,608 words × 16 bits × 4 banks. It is packaged in 84-ball FBGA (µBGA) package. • Power supply: VDD, VDDQ = 1.8V ± 0.1V

Contextual Info: DATA SHEET 2G bits DDR2 SDRAM EDE2116AEBG 128M words x 16 bits Specifications Features • Density: 2G bits • Organization  16M words × 16 bits × 8 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) and Halogen-free • Power supply: VDD, VDDQ = 1.8V ± 0.1V

EDE1116ACBG

Contextual Info: PRELIMINARY DATA SHEET 1G bits DDR2 SDRAM EDE1116ACBG-1J 64M words x 16 bits, 1066Mbps Specifications Features • Density: 1G bits • Organization  8M words × 16 bits × 8 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

Contextual Info: PRELIMINARY DATA SHEET 256M bits DDR2 SDRAM EDE2516AEBG-1J 16M words x 16 bits, 1066Mbps Specifications Features • Density: 256M bits • Organization ⎯ 4M words × 16 bits × 4 banks • Package ⎯ 84-ball FBGA ⎯ Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

Contextual Info: DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Description Features The EDE5116AFSE is a 512M bits DDR2 SDRAM organized as 8,388,608 words × 16 bits × 4 banks. It is packaged in 84-ball FBGA (µBGA) package. • Power supply: VDD, VDDQ = 1.8V ± 0.1V

ede2116aebg

Abstract: DDR2-800 Humidifier EDE2116AEBG-8E-F ELPIDA DDR2 SDRAM
Contextual Info: DATA SHEET 2G bits DDR2 SDRAM EDE2116AEBG 128M words x 16 bits Specifications Features • Density: 2G bits • Organization  16M words × 16 bits × 8 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) and Halogen-free • Power supply: VDD, VDDQ = 1.8V ± 0.1V

DDR2-400

Abstract: DDR2-533 DDR2-667 EDE5116AFSE EDE5116AFSE-4A-E EDE5116AFSE-5C-E EDE5116AFSE-6E-E
Contextual Info: DATA SHEET 512M bits DDR2 SDRAM EDE5116AFSE 32M words x 16 bits Features • Density: 512M bits • Organization  8M words × 16 bits × 4 banks • Package: 84-ball FBGA  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V • Data rate: 667Mbps/533Mbps/400Mbps (max.)

E1369

Abstract: DDR2-667
Contextual Info: PRELIMINARY DATA SHEET 1G bits DDR2 SDRAM EDE1116BEBG 64M words x 16 bits Specifications Features • Density: 1G bits • Organization  8M words × 16 bits × 8 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) and Halogen-free • Power supply: VDD, VDDQ = 1.5V ± 0.075V

DDR2-667

Abstract: EDE5116AJBG
Contextual Info: PRELIMINARY DATA SHEET 512M bits DDR2 SDRAM WTR Wide Temperature Range EDE5116AJBG-LI (32M words x 16 bits) Features • Density: 512M bits • Organization  8M words × 16 bits × 4 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

DDR2-667

Abstract: EDE1116ACSE-LI
Contextual Info: DATA SHEET 1G bits DDR2 SDRAM WTR Wide Temperature Range EDE1116ACSE-LI (64M words x 16 bits) Features • Density: 1G bits • Organization  8M words × 16 bits × 8 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

EDE1116ACSE-LI

Abstract: DDR2-667
Contextual Info: DATA SHEET 1G bits DDR2 SDRAM WTR Wide Temperature Range EDE1116ACSE-LI (64M words x 16 bits) Specifications Features • Density: 1G bits • Organization  8M words × 16 bits × 8 banks • Package  84-ball FBGA  Lead-free (RoHS compliant) • Power supply: VDD, VDDQ = 1.8V ± 0.1V

20890

Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET DS05-20890-1E PAGE MODE FLASH MEMORY CMOS 32 M 2 M x 16/1 M × 32 BIT MBM29PL3200TE/BE 70/90 • DESCRIPTION The MBM29PL3200TE/BE is 32 M-bit, 3.0 V-only Page mode Flash memory organized as 2 M words of 16 bits each or 1 M words of 32 bits each. The device is offered in 90-pin SSOP and 84-ball FBGA packages. This device

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)