Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
    Manufacturer Search

    82425EX Search Results

    SF Impression Pixel

    82425EX Price and Stock

    Intel Corporation

    Intel Corporation S82425EX

    PCI Bus Controller, MOS, PQFP208
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Rochester Electronics S82425EX 46,326 1
    • 1 -
    • 10 -
    • 100 $15.59
    • 1000 $13.95
    • 10000 $13.13
    		Buy Now

    Intel Corporation S82425EXSZ897

    PCI SYSTEM CONTROLLER PCI Bus Controller, MOS, PQFP208
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA S82425EXSZ897 46
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    82425EX Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    82420EX

    Contextual Info: in te i 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER PSC AND 82426EX ISA BRIDGE (IB) Host CPU - 2 5 - 3 3 MHz ln te l4 8 6 T M and Programmable Attribute Map for First 1 MByte of Main Memory O v e rD riv e P ro ce ss o rs 100% ISA Compatible


    OCR Scan     		82420ex82425ex82426ex PDF

    82425EX

    Abstract: 82426EX intel 82c59 82C59 82c42
    Contextual Info: Ä P Ä I DIM F KD!i]ÄcirO Kl in te i 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER (PSC AND 82426EX ISA BRIDGE (IB) Host CPU - 2 5 - 3 3 MHz lnte!486TM and OverDriveTM Processors — L1 Write-Back Support Programmable Attribute Map for First


    OCR Scan     		82420ex82425ex82426ex486tm+8clk20ut2x820372x82059irq12/m1x82cs4intel 82c5982c5982c42 PDF

    82426EX

    Abstract: 82420EX 82425EX
    Contextual Info: in y Ö M F K [M Ä Y O M 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER PSC AND 82426EX ISA BRIDGE (IB) • Host CPU - 2 5 - 3 3 MHz Intel486 and OverDrive™ Processors — L1 Write-Back Support ■ Programmable Attribute Map for First


    OCR Scan     		82420ex82425ex82426ex27-bit+682c5482c59iocs16memcs16clk20ut2x82c37 PDF

    82425EX

    Abstract: 82426EX 82420 82420EX t34i osa-104 AA T37B t17c tag044 82C42
    Contextual Info: 82420EX PCISET DATA SHEET 82425EX PCI SYSTEM CONTROLLER PSC AND 82426EX ISA BRIDGE (IB) Y Y Y Y Host CPU 25 – 33 MHz Intel486 TM and OverDrive TM Processors L1 Write-Back Support Integrated DRAM Controller 1 to 128 MByte Main Memory 70 ns Fast Page Mode DRAM SIMMs


    Original     		82420ex82425ex82426exintel486+827-bits82420t34iosa-104aa t37bt17ctag04482c42 PDF

    all ic data

    Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
    Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile


    Original     		all ic dataeiaj so 8 solder heating profileintel 80486 dx4intel dx4+6paste profilesmt processdx4 208 sqfp80c196kb 1988diode databookintel 80486 PDF

    all ic data

    Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
    Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile


    Original     		all ic dataland pattern for tsop 2pace craft 10082425ex+6intel 8048680486 dx480c196kb 1988qfp package thermal resistance55a5tsop infrared PDF

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		conductivi49-58intel reflow soldering profile bgaall ic datainfrared heating gun+782425ex80c196kb 198828f01080c196kbpcb warpage after reflowintel reflow soldering profile bga intelconveyor belt alignment PDF

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Contextual Info: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		ch09wipall ic dataintel reflow soldering profile bgainfrared heating gun+782425exintel 80486 dx4hot air bgaland pattern for tsoptsop infrared80c196kb 1988land pattern qfp 208 PDF