81119 Search Results

Contextual Info: T1070P www.vishay.com Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 0.72 x 0.72 x 0.22 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 0.25

101490

Abstract: 33797 B57875S0212F000 B57875S0212H000 k 3569 81 718990 3567 EPCOS
Contextual Info: NTC thermistors for temperature measurement Leaded NTCs, lead spacing 5 mm Series/Type: Date: B57875 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

101490

Abstract: 40409 Transistor 20417 33797 40409 73006 B57885S0103 001 Epcos 2908 EPCOS 800 376 B57885S0212
Contextual Info: NTC thermistors for temperature measurement Leaded NTCs, lead spacing 5 mm Series/Type: Date: B57885 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

lenovo

Abstract: OZ862AS lenovo t42 VIA10 foxconn FB-23 VIA15 FMC-101 Lenovo fpc R4573
Contextual Info: 本图纸版权属原厂家所有 5 仅在服务该产品使用者时使用 4 3 立成网：综合性笔记本维修服务平台 2 1 < SONOMA > DC/DC & Charger CPU VR ARIES II BLOCK DIAGRAM Dothan Yonah /Alviso D +1.8V MAX6648 +VCCP C P:5 P:4 VCORE_VGA LVDS

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

mj 13002

Abstract: transistor 40409 101490 40409 Transistor 62552 42003 75282 40409 NTC Thermistor 301 B57885S0103 001
Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 5 mm Series/Type: B57885S Date: February 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

NCP81102

Contextual Info: 81119 Multiple-Phase Controller with SVID Interface for Desktop and Notebook CPU Applications The 81119 Multi−Phase buck solution is optimized for Intel VR12.5 compatible CPUs with user configurations of 4/3/2/1 phases. The controller combines true differential voltage sensing,

431h

Contextual Info: F E 81X1 S e rie s So Interface Modules Modules d'interface So Key Features Caractéristiques Meat CCm I.430 for So Interface Répond à la norme CCITTI.430 pour interface So. Les transformateurs FE8101 figurent sur la liste LNZ du CNET. 1500, & 500 Vrms Isolation standard

DW025ACL-M

Abstract: kelvin 1102 DW025ABK-M UL-1950 DW025
Contextual Info: Data Sheet March 31, 2008 DS04-028 ver. 1.1 Replaces DS04-028 ver. 1.0 DW025 Triple Output-Series Power Modules: 36 Vdc to 75 Vdc Input; 25 W Options n Short pins: 2.79 mm ± 0.25 mm (0.110 in. ± 0.010 in.) n Negative logic remote on/off n Heat sink available for extended operation

Lucent dw025acl-m

Abstract: D 1108 DW025ABK-M kelvin 1102 DW025ACL-M
Contextual Info: Data Sheet June 1997 DW025 Triple Output-Series Power Modules: 36 Vdc to 75 Vdc Input; 25 W Options • Short pins: 2.79 mm ± 0.25 mm 0.110 in. ± 0.010 in. ■ Negative logic remote on/off ■ Heat sink available for extended operation Description The DW025 Triple Output-Series Power Modules use

Contextual Info: Data Sheet March 31, 2008 DS04-028 ver. 1.1 Replaces DS04-028 ver. 1.0 DW025 Triple Output-Series Power Modules: 36 Vdc to 75 Vdc Input; 25 W Options n Short pins: 2.79 mm ± 0.25 mm (0.110 in. ± 0.010 in.) n Negative logic remote on/off n Heat sink available for extended operation

Contextual Info: T1070P Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 0.72 x 0.72 x 0.22 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 0.25 • High photo sensitivity

foxconn

Abstract: compal RTL8101L Compal Electronics DCL55 2L202 DCL51
Contextual Info: A 本图纸版权属原厂家所有 B 仅在服务该产品使用者时使用 C E 立成网：综合性笔记本维修服务平台 D 1 1 M O .C B N G Compal Confidential EN 2 2 H C DCL55 Schematics LIDocument Banias ICP uFCBGA/uFCPGA Package with Montara-GM

Contextual Info: Data Sheet March 31, 2008 DS04-028 ver. 1.1 Replaces DS04-028 ver. 1.0 DW025 Triple Output-Series Power Modules: 36 Vdc to 75 Vdc Input; 25 W Options n Short pins: 2.79 mm ± 0.25 mm (0.110 in. ± 0.010 in.) n Negative logic remote on/off n Heat sink available for extended operation

Lucent dw025acl-m

Abstract: DW025ABK-M DW025
Contextual Info: Data Sheet June 1997 m i c r o e l e c t r o n i c s group Lucent Technologies Bell Labs Innovations DW025 Triple Output-Series Power Modules: 36 Vdc to 75 Vdc Input; 25 W Options • Short pins: 2.79 mm ± 0.25 mm 0.110 in.±0.010 in. ■ Negative logic remote on/off

GR-436-CORE

Abstract: 250km GR-1244-CORE GR-253 GR-253-CORE PM5346 STM-16
Contextual Info: PMC-Sierra, Inc. APPLICATION NOTE ISSUE 1 LAN and WAN Timing Considerations for PMC-Sierra ATM PHY Devices LAN AND WAN TIMING CONSIDERATIONS FOR PMC-SIERRA ATM PHY DEVICES Preliminary Information Issue 1: September, 1996 PMC-Sierra, Inc. #105-8555 Baxter Place, Burnaby, BC Canada V5A 4V7 604 415 6000

Contextual Info: 1 1 23456789A2345678B1 1CDEF11BEE17E11171 1 1 1 1 1 1  B!"8#"$9%1 #&

DW025ABK-M

Abstract: DW025ACL-M kelvin 1102 UL-1950 lucent DC-DC POWER MODULE 474W
Contextual Info: Data Sheet June 1997 DW025 Triple Output-Series Power Modules: 36 Vdc to 75 Vdc Input; 25 W Options • Short pins: 2.79 mm ± 0.25 mm 0.110 in. ± 0.010 in. ■ Negative logic remote on/off ■ Heat sink available for extended operation Description The DW025 Triple Output-Series Power Modules use

Contextual Info: Amphenol RF Interconnects UHF/Mini UHF Low Frequency RF Connectors Materials Body/Metal parts Contacts Centre MALE Centre FEMALE Under-plate Plating Insulator Crimp Ferrules Electrical – Brass – Brass – Brass – Nickel – Tinned or Silver or Gold – Teflon or Phenolic

Contextual Info: Mini-UHF Fig. 1 Mini-UHF Amphenol Fig. 2 A- C* i. -r V b > Crimp Type Plugs with bright nickel finish 81-115N-1000 81-114-RFX Crimp Type Plug with black chromate finish 81-196-RFX 81-181-RFX 81-115BK-1000 Fig. 3 Fig. 4 .096 2.4 dia. 4 places ^ T .436(11.1)

sl8z4

Abstract: diagram HANNSTAR j mv 4 M54P PDTA144E g792 sl8yb hy5ps561621afp-25 EC565 diagram HANNSTAR k mv M54-p
Contextual Info: 本图纸版权属原厂家所有 A 仅在服务该产品使用者时使用 B C LWG2-D Block Diagram Discrete Mobile CPU CLK GEN. 4 IDT CV125PA 19 PCB STACKUP TOP 400/533/667MHz LVDS DDR2 533/667MHz 533 MHz 11,12 DDR2 Calistoga Ver.:A3 :71.945PM.A0U / QK58

T2943

Abstract: ns681680 AOD4411 Quanta ED2L AC309 quanta ED2L Socket AM2 amd pinout diagram socket AM3 quanta computer
Contextual Info: 本图纸版权属原厂家所有 1 仅在服务该产品使用者时使用 2 3 4 立成网：综合性笔记本维修服务平台 5 6 7 ED2N-UMA DESIGN RUN POWER SW A AC/BATT CONNECTOR PG 37 BATT CHARGER PG 37 Dothan/Celerom VER : E3A A DC/DC +3V_SRC +5VSUS

Contextual Info: T1070P www.vishay.com Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: chip • Package form: single chip • Dimensions L x W x H in mm : 0.72 x 0.72 x 0.22 • Wafer diameter (in mm): 100 • Radiant sensitive area (in mm2): 0.25

NCP81102

Contextual Info: 81119, 81119A Multiple-Phase Controller with SVID Interface for Desktop and Notebook CPU Applications The 81119/A Multi−Phase buck solution is optimized for Intel VR12.5 compatible CPUs with user configurations of 4/3/2/1 phases. The controller combines true differential voltage sensing,