810A RESISTOR Search Results

MB11A

Contextual Info: M B810A/M B811A M B812A/M B813A MB814A ULTRA HIGH SPEED ECL ICs J u ly 1989 E d itio n 2.0 ULTRA HIGH SPEED ECL FAMILY The Fujitsu MB 810A series is an ultra high speed logic designed fo r high speed digital systems. The MB 810A series is suitable n o t o n ly fo r a high speed trans­

470 ohm resistor

Abstract: resistor 470 ohm CTS Series 750 1/of resistor 470 ohm CTS 750 series 750 CTS
Contextual Info: D ua l Te rm i n a t o r CTS Dual Terminator Schematics Standard CTS Dual Terminator products contain 2N-2 resistors of two different values with each resistor value connected to a common buss. CTS assigns the resistance value portion of the standard part numbers of the dual terminator network in two

resistor 270 ohm

Abstract: CTS 750 series
Contextual Info: D u a l Te rm i n a t o r Standard CTS Dual Terminator products contain 2N-2 resistors of two different values with each resistor value connected to a common buss. CTS assigns the resistance value portion of the standard part numbers of the dual terminator network in two

150 ohms resistor

Abstract: 810a resistor TR13 752091103GP of resistor 560 ohms resistor 390 ohms 752091103gptr13 l 101c 681
Contextual Info: Series 752 Surface Mount Resistor Network FEATURES • High Density Packaging • Low Profile • Inputs/Outputs Available • • • • • • • - Single Row Terminations [SRT] – 08, 09, 10, 12 - Dual Row Terminations [DRT] – 16, 18, 20, 24 Nickel Barrier Solder-Coated Pads

l 101c 681

Contextual Info: Series 752 Surface Mount Resistor Network FEATURES • High Density Packaging • Low Profile • Inputs/Outputs Available • • • • • • • - Single Row Terminations [SRT] – 08, 09, 10, 12 - Dual Row Terminations [DRT] – 16, 18, 20, 24 Nickel Barrier Solder-Coated Pads

TR13

Abstract: 150 ohms resistor 810a resistor RESISTOR NETWORK 4.7K 8 pin B 331 G
Contextual Info: Series 753 Surface Mount Resistor Network FEATURES • High Density Packaging • Low Profile • Inputs/Outputs Available • • • • • • • - Single Row Terminations [SRT] – 08, 09, 10, 12 - Dual Row Terminations [DRT] – 16, 18, 20, 24 Nickel Barrier Solder-Coated Pads

Contextual Info: Series 753 Surface Mount Resistor Network FEATURES • High Density Packaging • Low Profile • Inputs/Outputs Available • • • • • • • - Single Row Terminations [SRT] – 08, 09, 10, 12 - Dual Row Terminations [DRT] – 16, 18, 20, 24 Nickel Barrier Solder-Coated Pads

CTS 767 Series

Abstract: 333 resistor pack for resistor 20 ohms to 2000 ohms
Contextual Info: Series 768 Surface Mount Resistor Network FEATURES • • • • • • • • • • Medium Body Design Surface Mount Gull Wing Design Low Profile, Board to Network Clearance – 0.0075” ±0.0025” Solid Ceramic Construction No Internal Dendrite Growth

PDP-100

Abstract: TR13
Contextual Info: Series 768 Surface Mount Resistor Network FEATURES • • • • • • • • • • Medium Body Design Surface Mount Gull Wing Design Low Profile, Board to Network Clearance – 0.0075” ±0.0025” Solid Ceramic Construction No Internal Dendrite Growth

Marking code 016w

Contextual Info: Series 766 Surface Mount Resistor Network FEATURES • • • • • • • • • • Narrow Body Design Surface Mount Gull Wing Design Solid Ceramic Construction No Internal Dendrite Growth Requires 30% Less Board Space than Molded Products of the Same Power Rating

333 resistor pack

Abstract: TR13 810a resistor
Contextual Info: Series 766 Surface Mount Resistor Network FEATURES • • • • • • • • • • Narrow Body Design Surface Mount Gull Wing Design Solid Ceramic Construction No Internal Dendrite Growth Requires 30% Less Board Space than Molded Products of the Same Power Rating

TR13

Contextual Info: Series 767 Surface Mount Resistor Network FEATURES • • • • • • • • • • Medium Body Design Surface Mount Gull Wing Design Solid Ceramic Construction No Internal Dendrite Growth Requires 30% Less Board Space than Molded Products of the Same Power Rating

Marking code 016w

Contextual Info: Series 766 Surface Mount Resistor Network FEATURES • • • • • • • • • • Narrow Body Design Surface Mount Gull Wing Design Solid Ceramic Construction No Internal Dendrite Growth Requires 30% Less Board Space than Molded Products of the Same Power Rating

RESISTOR 6.8k NETWORK

Contextual Info: Series 768 Surface Mount Resistor Network FEATURES • • • • • • • • • • Medium Body Design Surface Mount Gull Wing Design Low Profile, Board to Network Clearance – 0.0075” ±0.0025” Solid Ceramic Construction No Internal Dendrite Growth

Contextual Info: Series 767 Surface Mount Resistor Network FEATURES • • • • • • • • • • Medium Body Design Surface Mount Gull Wing Design Solid Ceramic Construction No Internal Dendrite Growth Requires 30% Less Board Space than Molded Products of the Same Power Rating

resistor 680 ohm

Abstract: 560 ohm RESISTOR
Contextual Info: Leaded Surface Mount Series 766 Technical Data Features • • • • • • • • • Narrow body design Solid ceramic construction No internal dendrite growth Requires 30% less board space than molded products of the same power rating Meets EIA PDP SOGN-0001 outline

CTS 750 series

Abstract: CTS Series 750
Contextual Info: Leaded Surface Mount Series 767 Technical Data Features • • • • • • • • • Medium body design Solid ceramic construction No internal dendrite growth Requires 30% less board space than molded products of the same power rating Meets EIA PDP SOGN-0001 outline

710a

Abstract: resistor 100k ohm PDP-100 33 ohm 16 pin dip resistor network electronic schematic thevenin 680k ohm resistor
Contextual Info: Leaded Surface Mount Series 768 Technical Data Features • • • • • • • • • Medium body design Low profile-board to network clearance of 0.005”/0.010” Solid ceramic construction No internal dendrite growth Conforms to EIA PDP-100 SOGN-0002

Contextual Info: Leaded Surface Mount Series 767 Technical Data Features • • • • • • • • • Medium Body Design Solid Ceramic Construction No Internal Dendrite Growth Requires 30% Less Board Space Than Molded Products of the Same Power Rating Meets EIA PDP SOGN-0001 Outline

Contextual Info: Leaded Surface Mount Series 768 Technical Data Features • • • • • • • • • Medium Body Design Low Profile-Board to Network Clearance of 0.005”/0.010” Solid Ceramic Construction No Internal Dendrite Growth Conforms to EIA PDP-100 SOGN-0002

330 ohm resistor pack

Contextual Info: Leadless Surface Mount Series 753 Technical Data Features • • • • • • • • • High Density Packaging Low Profile Inputs/Outputs Available: Single Row Terminations SRT – 8, 9, 10, 12 Dual Row Terminations (DRT) – 16, 18, 20, 24 Nickel Barrier Solder-Coated Pads

Contextual Info: Leaded Surface Mount Series 768 Technical Data Features • • • • • • • • • Medium Body Design Low Profile-Board to Network Clearance of 0.0075”/0.0025” Solid Ceramic Construction No Internal Dendrite Growth Conforms to EIA PDP-100 SOGN-0002

IN753

Abstract: 50 Ohm Termination pad
Contextual Info: Leadless Surface Mount Series 753 Technical Data Features • • • • • • • • • High Density Packaging Low Profile Inputs/Outputs Available: Single Row Terminations SRT – 8, 9, 10, 12 Dual Row Terminations (DRT) – 16, 18, 20, 24 Nickel Barrier Solder-Coated Pads

560k ohm resistor

Abstract: resistor 270 ohm 241A* referen 771a 150 ohms resistor 710a resistor 100k ohm PDP-100 710A series
Contextual Info: Leaded Surface Mount Series 768 Technical Data Features • • • • • • • • • Medium Body Design Low Profile-Board to Network Clearance of 0.0075”±0.0025” Solid Ceramic Construction No Internal Dendrite Growth Conforms to EIA PDP-100 SOGN-0002