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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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54112-104280850LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10118085-101-10LF
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Amphenol Communications Solutions
|
Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch |
PDF
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54122-110080850LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch |
PDF
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10118085-101-20LF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded horizontal header, Surface mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch with peg. |
PDF
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