78 BALL FBGA THERMAL RESISTANCE Search Results

bd248

Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

ep600i

Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Contextual Info: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

FBGA DDR3 x32

Abstract: MT41K256M32 MT41K256M16 MT41K256M3 MICRON fBGA package code
Contextual Info: Preliminary‡ 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D

MT41K256M32

Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
Contextual Info: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA

MT41K256M32

Abstract: FBGA DDR3 x32 MT41K256M3 MT41K256M16
Contextual Info: Preliminary‡ 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D

transistor smd G46

Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Contextual Info: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG

MT41K512M16

Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
Contextual Info: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)

MT41K256M16

Contextual Info: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)

MT41K512M16

Abstract: MT41K256M16 96 ball fbga thermal resistance micron Theta JC of FBGA MICRON fBGA package code micron marking code information
Contextual Info: Preliminary‡ 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)

Contextual Info: CY7C1461AV25 CY7C1463AV25 CY7C1465AV25 PRELIMINARY 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles

CY7C1460AV25

Abstract: CY7C1462AV25 CY7C1464AV25 K973
Contextual Info: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

CY7C1462AV25

Abstract: CY7C1460AV25 CY7C1464AV25
Contextual Info: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states

Contextual Info: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states

Contextual Info: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.

Contextual Info: Preliminary‡ 8Gb: x4, x8 1.5V TwinDie DDR3 SDRAM Features TwinDie DDR3 SDRAM MT41J2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41J1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Features Marking Options • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks

Contextual Info: Preliminary‡ 8Gb: x4, x8 1.5V TwinDie DDR3 SDRAM Features TwinDie DDR3 SDRAM MT41J2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41J1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Features Marking Options • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks

DDR3L SDRAM

Abstract: TN0008 MT41K1G8
Contextual Info: Preliminary‡ 8Gb: x4, x8 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41K1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Description Options Marking • Configuration – 128 Meg x 4 x 8 banks x 2 ranks

CY7C1461AV33

Abstract: CY7C1463AV33 CY7C1465AV33
Contextual Info: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Supports up to 133-MHz bus operations with zero wait

CY7C1441AV25

Abstract: CY7C1443AV25 CY7C1447AV25
Contextual Info: CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM Functional Description[1] Features • Supports 133-MHz bus operations • 1M x 36/2M x 18/512K x 72 common I/O • 2.5V core power supply • 2.5V/1.8V I/O power supply

DDR3L SDRAM

Abstract: F0513 MT41K1G8
Contextual Info: 8Gb: x4, x8 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41K1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Description Options Marking • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks