75U71 Search Results

pmi ref 02

Abstract: PK-70873-0259
Contextual Info: 10 PLATING: NOTES: 1 - HOUSING M ATERIAL: LCP G LAS S FILLED UL 94V-0 COLOR: BLACK. 15u70.38um MIN. GOLD P L A T E IN CONTACT A R E A 75u71.9um MIN. TIN IN SOLDER AR EA . BOTH OVER 50u71.27um MIN. NICKEL O VERALL. 2 - TERM INAL M ATERIAL: PHOSPHOR BRONZE 3 - SEE S H E E T 2 FOR CIRCUIT SIZE,

A7910

Contextual Info: 10 2.00 ± 0 .0 8 NON-ACCUM 0 0 .7 1 1 0 .0 8 ROW A RECOMMENDED PCB LAYOUT ROW B NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.

Contextual Info: 10 87758 VIEW P 0.50 TYP BOTH S ID E ' 4.00 GOLD REF MEAS POINT A A PART NUMBER CKT SIZE 8 7 7 5 8 -0 0 0 8 8 A I/ B 7.90 6.00 \& \0 O 2 O \X \Ÿ \ A NOTES: 1. MATERIAL: HOUSING: 30% G.F. NYLON 46. 9 4 V -0 . COLOR: BLACK PIN: 0.50mm SO. PHOSPHOR BRONZE 510

Contextual Info: 10 2.00 ±0.08 NON-ACCUM. 0 0.71 ±0.08 2.00 ±0.08 ROW 4.19 A RECOMMENDED PCB LA Y O U T 2.00 NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.

Contextual Info: 10 •B - 2.0 0 ±0.08 NON-ACCUM. -A 0 0.71 ±0.08 ROW A 4.19 2.00 mm RECOMMENDED PCB LAYOUT ROW B 25 NOTES: 1 HOUSING M ATER IAL: G LA S S FILLED HIGH TEMP THERM OPLASTIC, COLOR: BLACK 2) TERM IN AL M ATER IAL: PHOSPHOR BRONZE SEE TAB LE 7) 3) S E E S H T 2 & 3 FOR CKT SIZE, P A R T NUMBERS

79107-7024

Abstract: 79107-7012 79107-0054
Contextual Info: 10 2.0 0 ± 0.08 0 0 .7 1 1 0 .0 8 NON-ACCUM a 1/ NJ Tr + i| ¡I I f / n •4 I ROW A I ROW B / I RECOMMENDED PCB LAYOUT f a SECTION B-B NOTES: 1) HOUSING M ATE R IA L: G LA S S FILLED HIGH TEMP THERM OPLASTIC, COLOR: BLACK 2) TERM IN AL M ATER IAL: PHOSPHOR BRONZE

Contextual Info: 10 2 .0 0 ± 0.08 N O N -A C C U M . t0 .0 8 2.0 0 ±0.08 ROW A R E C O M M E N D E D PCB L A Y O U T NOTES: 1 HODSING NATERIAD: GDASS FIDDED HIGH TENP THERNOPDASTIC, CODOR: BDACK 2) TERMINAD MATERIAD: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PA R T NDNBERS

Contextual Info: 10 2.0 0 ± 0.08 NON-ACCUM. R OW 0O.7UO.O8 A RECOMMENDED PCB LAYOUT ROW B NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 8, 3 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 4 FOR VOIDS.

5 PIN molex

Contextual Info: 10 2.00 ± 0.0 8 NON-ACCUM. RO W A RECOMMENDED R OW PCB LAYOUT B NOTES: SEE TABLE HOUSING M A TE R IA L: G L A S S FILLE D HIGH TEMP TH E R M 0H LA 5TIC , COLOR: BLACK TE R M IN AL M A T E R IA L: PHOSPHOR BRONZE S E E SHT 2 FOR CKT SIZE, P A R T NUMBERS

cd 1619

Contextual Info: 10 2.0 0 ± 0.08 0 0 .7 1 1 0 .0 8 NON-ACCUM / 1/ n / NJ Tr + i| ¡I I f a •4 I ROW A I ROW B I RECOMMENDED PCB LAYOUT f a SECTION B-B SEE TAB LE 7) ■(2.00) PLATING OPTION: 0.38 "O " NOTES: 1) HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK