7456 IC Search Results

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 AO 7456 JM M . 554 [115.67] M AX- • i i . a - *4.612 [117.1+] — I -A _L £ | - - .550 [11 9 7 ] REF TYP 000 TOP OF P C B TO BOTTOM OF OPENING B UJ II l_ L _

MERA-7456

Contextual Info: MMIC Amplifier MERA-7456+ Typical Performance Data NOTE: Use PDF Bookmarks to view DATA at required conditions or to view GRAPHS. Definitions: Input Return Loss = -S11 dB Gain(Power Gain) = S21 (dB) Reverse Isolation = -S12 (dB) Output Return Loss = -S22 (dB)

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 C2 7456 JM - - *3.454 [ß 7.73] MAX- - n n rn n n B 55D [1197] REF TYP NOTES: O o 1. CONNECTOR MATERIALS: -H aT HOUSING: THERMOPLASTIC UL94 V -0 r>d CONTACTS/SHIELD: a SHIELD PLATING: NICKEL OR TIN

CI 7456

Abstract: 44 128
Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A2 7456 JM B s o ci |— .135 [3.43] MAX T NOTES: 1. CONNECTOR MATERIALS: |— .503 [12.78] MAX -*3.536 [B9.B1]- HOUSING: .125 [3.17]±.Û1 Û [0.25] THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A1 7456 JM .448 [11.38] REF TYP B h -.135 [ i « ] 2 X T rrcD~l T + + • + + • + + + + ■ + + 1 + ■+ ■ V+- +- + - + + +- +■ ■ » + + S1 CD L NOTES: \— 1. CONNECTOR MATERIALS: .503 [1Z.78] MAX HOUSING: THERMOPLASTIC UL94

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 C2 7456 JM - "4.354[15.67] MAX- n n n rï n n n .550 [13.97] REF TYP B 25' 14 i •sP T B Ï r - * 4 J 0 D [109.22]o -H NOTES: 1. CONNECTOR MATERIALS: HOUSING: u u u u u

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A2 7456 JM -*2 ,3 5 4 [59.79] M AX - -*.148 [3.75] 1Z -*2.412 [61.26]- ' ' o B 000 (TOP OF PCB TO BOTTOM OF OPENING) QTTfZi : -.010 MAX RADIUS(4) SUGGESTED PANEL OPENING •*.0S3 [Z.1Z](5) NOTES: 1. CONNECTOR MATERIALS: BOTTOM SURFACE OF JACK(PC8 SURFACE)

Contextual Info: DATE REV ECN 2/1/06 A2 7456 JM 12 -2 8 -1 0 A3 9110 TRM APP’D. BY 448 [11.38] B B .135 [3.43] 2 - h 503 [12.78] MAX NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: .865 [21.97] MAX.- X DATE REV ECN 2/1/06 A3 7456 JM 9/20/06 A4 7746 TRM ’m ’ CM o -H o o 71 □ APP'D. BY -H o in in — .060 [1.52] 2 B B — .280 [7.11] (2) 2.150 [54.61] "0 .425 [10.80] 4 + 1 + 3 +5 +7 2+ V + 8+ -f1 + 3 + 5 + 7 2+4+6+8+ +1 + 3 + 5 + 7

Contextual Info: REV ECN 2/1/06 DATE A2 7456 JM 1 2 -2 8 -1 0 A3 9110 TRM APP’D. BY B B in r-» o o .135 [3.43] 2 — h .503 [12.78] MAX NOTES: [— 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: COPPER ALLOY 125 [3181 + -°20 .IZD LA1ÖJ _m

Contextual Info: DATE REV 2/1/06 ECN A2 7456 JM 2 -1 2 -0 9 A3 8660 TA APP’D. BY • 1.205 [30.61] MAX ■ i .550 [13.97] REF B B CN — 1.000 [25.40] — io ^ m 5 XI ♦ ♦ ♦ ♦ -.523 [13.28] MAX NOTES: — .125 [3.17]±.010 [0.25] 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0

Contextual Info: REV ECN 2/1/06 DATE A2 7456 JM 1 0 -2 3 -0 9 A3 8851 TRM APP’D. BY .040 [1.02] 5 — -.0 28 [.71] (6) i i i i i i lO o mm i H i i i i i in o ro -.4 00 [10.16].028 [0.71] MINIMUM PCB THICKNESS .100 [2.53] ±.010 [0.25] — n .050 [1.27] (2) — -| — P.C.B. RECOMMENDED HOLE LAYOUT

Contextual Info: 2 DATE REV. ECN A P P ' D BY 2-2-06 A2 7456 JM 7-7-06 A3 7671 TRM *{.448 [ I I .38] PORT SPA C IN G NOTES: - TOLERANCES COMPLY WITH F . C . C . D IM E N S IO N REQUIREMENTS ALL OTHERS ± . 0 0 5 [ 0 . I 3 ] UNLESS OTHERWISE SPECIFIED. - D I M E N S I O N S SHOWN W I T H

Contextual Info: 2 DA T E REV. E CN A P P ' D BY 2-2-06 A2 7456 JM *{.448 [ I I .38] PORT S P A C IN G NOTES: - TOLERANCES COMPLY W ITH F . C . C . D IM E N SIO N REQ UIREMENTS ALL OTHERS ± . 0 0 5 1 0 . 1 3 ] UNLESS OTHERWISE SPECIFIED. - D I M E N S I O N S SH OW N W I T H

Contextual Info: - DATE REV ECN APP'D. BY 2 / 1/06 A1 74-56 JM - i m [ 2 .5 5 }t .m [0.25] ! X irt I B — - .725 [ 18.4-2 ] - •MAX NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

LSE B3

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 A2 74-56 JM B NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA [— .523 [13.2B] MAX SEE CHART FOR PART NUMBER

CT660056

Contextual Info: DATE REV ECN APP'D. BY 2/1/06 B2 74-56 JM s t-n B .550 [13.97] REF TYP S “W T T -*1.35D [39.37]- NOTES: 1. CONNECTOR MATERIALS: QO HOUSING: CED LT> THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: K> COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 2 / 1/06 A1 74-56 JM B û r-~ cj jL_L NOTES: 1. CONNECTOR MATERIALS: — .523 [13.28] HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: -.125 [3.17]±.ai0 [0.25] CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

DL1020

Abstract: TB293 m939 R04350B TB-293
Contextual Info: THIRD ANGLE PROJECTION 4 REV ECN No. OR M93927 M102713 Â REVISIONS DESCRIPTION DATE SU G G EST ED MOUNTING CONFIGURATION D R AUTH 08/19/04 01/12/06 NEW RELEASE ADDED ".WITH SMOBC” GF GF WP IL FOR DL1020 C A S E STYLE. ”q b ” PIN CONNECTION .080 .024 TYP.

micro sd connector

Contextual Info: DATE REV ECN APP'D. BY 2 /1 /0 6 A2 74-56 JM -*2231 [59.36] MAX- H -.448 [11.38] REF TYP B 3 i^ i - LTD O 1 O 1- 1 1-« LH LD OO |——.135 [143] 2 NOTES: 1. CONNECTOR MATERIALS: HOUSING: + H -+ + THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY

84ir

Contextual Info: DATE REV ECN APP'D. BY 2 / 1/06 B2 74-56 JM s ►i .550 [13.97] REF TYP Í B § NOTES: uO 1. CONNECTOR MATERIALS: g HOUSING: I 1 THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: CO PPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

NT 101

Abstract: SS-668806S-A-NF
Contextual Info: DATE REV ECN APP'D. BY 2/1/06 C2 74-56 JM - *3.454 [â 7.73] MAX-► S r<> -.550 [13.97] TYP REF B LO *3.200 [B1.2B] o 2 S NOTES: +Í 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0

IC TTL 7432

Abstract: IC 7402, 7404, 7408, 7432, 7400 ttl 74118 74189 memory ic 74138 74189 ttl memory TTL 74289 RC4458 IC 74373 ttl 74592
Contextual Info: Test and Measurement Systems Electronic Manufacturing Services ABI Electronics Limited Dodworth Business Park Barnsley S75 3SP South Yorkshire United Kingdom Tel: +44 0 1226 207420 Fax: +44 (0)1226 207620 www.abielectronics.co.uk ChipMaster Compact Professional IC List

jantx1n4954

Contextual Info: Zener Regulator Diodes Part Number 1N5338B 1N6637 SMBG5338B SMBJ5338B 1N5339A 1N5339B 1N5968 1N5968US JAN1N5968 JAN1N5968US JANTX1N5968 JANTX1N5968US JANTXV1N5968 JANTXV1N5968US SMBG5339B SMBJ5339B 1N5340A 1N5340B SMBG5340B SMBJ5340B 1N5341A 1N5341B 1N5969